» Supported CPU:
Intel® Core™ i7-1185G7E 1.8 GHz (up to 4.4 GHz, quad-core, TDP 15W)
Intel® Core™ i5-1145G7E 1.5 GHz (up to 4.1 GHz, quad-core, TDP 15W)
Intel® Core™ i3-1115G4E 2.2 GHz (up to 3.9 GHz, dual-core, TDP 15W)
Intel® Celeron® 6305/6305E 1.8 GHz (dual-core, TDP 15W)
» Support three independent display
» 3 x 2.5GbE ports
» 1 x M.2 A Key
» 1 x M.2 B Key (with SIM card slot)
» CE/FCC compliant
High Value Fanless DIN-Rail Embedded System
IEI DRPC-W series are compact, DIN-rail mounted embedded systems designed for IEI 3.5" single board computers. Its compact dimensions are appropriate for applications installed with limited space but requiring multiple I/O connectivity and enhanced performance. IEI DRPC-W series are designed to handle communication on the factory floor for IoT gateway, motion and vision applications.
Optimized for Improved Efficiency and Performance with 11th Gen. Intel® Core™/Celeron® Processor
Designed with 11th Generation Intel® Core™/Celeron® processor and Intel® UHD graphics, the DRPC-W-TGL fanless embedded system offers both excellent performance and energy efficiency. With up to 4 cores and 4.40 GHz max turbo frequency, the Intel® Core™ processor acts as the heart of the DRPC-W-TGL fanless embedded system and offers 2 times performance improvement over the predecessor Whiskey Lake.
Optimized Size Saves Cabinet Space
Based on IEI’s industrial-grade 3.5” embedded systems, the DRPC -W series are compact without sacrificing the flexibility in I/O expansion that is often required for IoT scalable sensor connectivity. Moreover, the front-side I/O design is easy for in-cabinet installation.
Switchgear
Automatic
optical
inspection
machine
Wrapping
machine
Telecom
cabinet
Traffic
signal
control
enclosures
Time-to-Market
Customization
The DRPC-W series’ enclosure is designed for 3.5" single board computers. With customizable I/O plates, the DRPC-W series allows customization to satisfy various requirements by using IEI's extensive 3.5" SBCs, WAFER series, offering diverse platform options from low-power to extreme performance. This helps assure an efficient and quick integration for customers' applications.
*Customized by project base
Easy Assembling & Maintenance
With an easy-to-open bottom cover, the DRPC-W series can delive r advantages of quick maintenance and Configure-to-Order Service (CTOS) for customers to reduce potential time to market and cost consumption.
» Fast assembly for all accessories
» Simple steps to open enclosure for maintenance, such as M.2, HDD, memory modules
» Accelerate system integrator's local configure-to-order assembly service for end customers
Scalable Wireless Communication Enables Remote Deployments
The DRPC-W-TGL is built with multiple wireless connectivity options necessary for remote and mobile deployments, which include Bluetooth, WiFi and 4G/LTE that enable connections with a variety of industrial IoT devices.
*Wireless M.2 modules are optional
-20°C ~ 60°C Wide Operating Temperature,
Shock and Vibration Resistance
The DRPC-W-TGL fanless embedded system features a ruggedized chassis which endures strict testing and validation assurance to ensure mission-critical reliability in the most complex edge IoT computing applications. The series has garnered various safety certificaions, including CE, FCC and CB, and can therefore be marketed in countries that observe strict EMC and safety standards.
- » Wide operating temperature range (-20°C to +60°C)
- » Half-sine wave shock 5G, 11ms, 3 shocks per axis
-20°C
60°C
Fanless System with Efficient Thermal Design
The DRPC-W-TGL thermal design is optimized for better heat conduction using a pin-fin heatsink concept. This enhances two-dimensional heat conduction and reduces flow impedance for better heat dissipation in this fan-less system. The overall weight is also reduced by 35%. Moreover, the reduced weight enhances system reliability in vibration-sensitive applications, such as AGV, making the DRPC-W-TGL has vastly superior performance to the traditional plate fin heat sink with continuous parallel fins.
Lightweight Cooling Solution
Advanced High-efficiency Fan Kit Releases Extreme
Computing Power
For computing-intensive applications, users could opt to add an external fan for an active cooling solution maintaining high system performance in high temperature environment. This design also brings high reliability by preventing dust or particles from getting into the hardware, and it is easy to disassemble and clean.
» TDP 15W -20°C ~ 60°C w/o external fan
» TDP 28W -20°C ~ 60°C with external fan
100% CPU Power
Easy Assembly
Silent Operation
Fan Kit P/N:
SF-DRPC-W-R10
Comprehensive I/O Interface
The DRPC-W-TGL is equipped with comprehensive I/O ports, but sometimes you need more connections. The reserved openings for COM ports and antennas maximize deployment flexibility.
Triple Intel® 2.5GbE Ports
The 2.5G on-board Ethernet kicks your Ethernet connection up a notch with an up to 2.5X bandwidth improvement. The DRPC-W-TGL can meet the bandwidth-intensive requirements such as large file transfers and high resolution video streaming, which is ideal for machine vision and AI edge computing applications.
Multi-Task with Triple LAN Ports
With triple LAN configuration, the DRPC-W-TGL is capable of connecting various devices such as sensors, multiple cameras, PLC or other hardware devices.
10 Gbps USB 3.2 Gen 2 Ports
With twice of the bandwidth compared to its previous generation, and backwards compatible with USB 2.0 and 3.0, the much improved USB 3.2 protocol accommodates data traffic needs of a variety of peripheral technologies for external storage devices, RAID enclosure, high-resolution digital cameras, webcam, video devices, and all other USB electronic devices.
Dual 4K Display with Immersive Graphics and Media Performance
The DRPC-W-TGL is equipped with Intel® UHD Graphics @450 MHz to display videos and images in stunning 4K resolutions. Among its dual independent display ports, the HDMI™ 1.4 and DisplayPort 1.4 can both support up to 4K high resolution. The DRPC-W-TGL empowers manufacturers to access clearer analysis and management via panel displays or interactive displays in intelligent factories and machine automation processes.
Triple Intel® 2.5GbE Ports
10 Gbps USB 3.2 Gen 2 Ports
Dual 4K Display with Immersive Graphics and Media Performance
The 2.5G on-board Ethernet kicks your Ethernet connection up a notch with an up to 2.5X bandwidth improvement. The DRPC-W-TGL can meet the bandwidth-intensive requirements such as large file transfers and high resolution video streaming, which is ideal for machine vision and AI edge computing applications.
Multi-Task with Triple LAN Ports
With triple LAN configuration, the DRPC-W-TGL is capable of connecting various devices such as sensors, multiple cameras, PLC or other hardware devices.
With twice of the bandwidth compared to its previous generation, and backwards compatible with USB 2.0 and 3.0, the much improved USB 3.2 protocol accommodates data traffic needs of a variety of peripheral technologies for external storage devices, RAID enclosure, high-resolution digital cameras, webcam, video devices, and all other USB electronic devices.
The DRPC-W-TGL is equipped with Intel® UHD Graphics @450 MHz to display videos and images in stunning 4K resolutions. Among its dual independent display ports, the HDMI™ 1.4 and DisplayPort 1.4 can both support up to 4K high resolution. The DRPC-W-TGL empowers manufacturers to access clearer analysis and management via panel displays or interactive displays in intelligent factories and machine automation processes.
Industrial Robotic Solution
IEI’s DRPC-W series features optimal IoT integration capability to offer faster connection speed, larger bandwidth, and rich I/O interface to easily connect with PLM, collaborative robotic arms, sensors or control centers through 2.5GbE LAN ports and USB 3.2 Gen 2 ports.
Warehouse Management Solution
IEI’s DRPC-W series features up to three 2.5GbE LAN port to connect with IP cameras for real-time access and storage control, and also rich USB ports for multi-device connection. Moreover, it is designed with flexible expansions to support well communication through 5G, Bluetooth or Wi-Fi modules.
Hardware I/O & Dimensions:
Selection of DRPC-W Total Solution
The DRPC-W is a series of compact DIN-rail embedded system with fanless design developed for entry, middle to high-end 3.5" single board computers, IEI WAFER series.
DRPC-W-JL
» Intel® Celeron® N5105 processor
» DIN-rail palm-size for limited space
» Fanless -20°C ~ 60°C operating temp
» 3 x 2.5 GbE, 2 x USB 3.2
» Dual display via HDMI™ & DP
» 1 x M.2 A key for Wi-Fi & BT
» 1 x M.2 B key for 5G/NVMe/AI accelerator
DRPC-W-EHL
» Intel® Celeron® J6412 processor
» DIN-rail palm-size for limited space
» Fanless -20°C ~ 60°C operating temp
» 2 x 2.5 GbE, 2 x USB 3.2
» Dual display via HDMI™ & DP
» 1 x M.2 A key 2230 for Wi-Fi & BT
» 1 x M.2 B key for 5G
DRPC-W-TGL
» Intel® Core™ i5-1145G7E/Intel® Celeron® 6305 processor
» DIN-rail palm-size for limited space
» Fanless -20°C ~ 60°C operating temp
» 3 x 2.5 GbE, 4 x USB 3.2
» Triple display via 2 HDMI™ & DP
» 1 x M.2 A key 2230 for Wi-Fi & BT
» 1 x M.2 B key for 5G
Hardware Spec.
| Form factor | |
|---|---|
| SBC Form Factor |
|
| 輸出/入介面 | |
| I/O Ports |
|
| 擴充槽 | |
| 擴充槽 |
|
| 系統 | |
| 冷卻方式/系統風扇 |
Fanless 4-pin external system fan connector |
| Drive Bays | 1 x 2.5” SATA 6Gb/s HDD/SSD bay |
| 指示燈與按鈕 | |
| 按鈕 |
1 x Power button 1 x Reset button |
| 指示燈 |
1 x Power LED 1 x HDD LED |
| Physical Characteristics | |
| Construction | Extruded aluminum alloy |
| Color | |
| Color | Black |
| Dimensions | |
| Dimensions | 176 x 116 x 67.8 (mm) |
| Weight | |
| Weight | 0.98/1.2 Kg |
| Environment | |
| Operating Temperature | -20°C ~ 60°C with air flow |
| Humidity | 10% ~ 95% non-condensing |
| Operating Vibration | 10-500 Hz,1.04 Grms, random, 1 hr/axis |
| Operating Shock | Half-sine wave shock 5G, 11ms, 100 shocks per axis |
| Safety & EMC | CE/FCC compliant |
| OS Support | |
| OS Support | Microsoft Windows 10 / Windows 11, Linux |
Ordering Information
| DRPC-W-TGL-U-i7C-R10 | Fanless System with Intel® Tiger Lake-U Core™ i7-1185G7E 1.8GHz (up to 4.4GHz, quad-core, TDP 15W), 3 x 2.5GbE Lan, 2 x HDMI, 1 x DP, 8GB memory pre-installed, 12V DC, RoHS |
|---|---|
| DRPC-W-TGL-U-i5C-R10 | Fanless System with Intel® Tiger Lake-U Core™ i5-1145G7E 1.5GHz(up to 4.1GHz,quad-core,TDP 15W),3 x 2.5GbE Lan,2 x HDMI,1 x DP,8GB memory pre-installed,12V DC,RoHS |
| DRPC-W-TGL-U-i3C-R10 | Fanless System with Intel® Tiger Lake-U Core™ i3-1115G4E 2.2GHz(up to 3.9GHz,dual-core,TDP 15W),3 x 2.5GbE Lan,2 x HDMI,1 x DP,8GB memory pre-installed,12V DC,RoHS |
| DRPC-W-TGL-U-CEC-R10 | Fanless System with Intel® Tiger Lake-U Celeron™ 6305E 1.8GHz(dual-core,TDP 15W),3 x 2.5GbE Lan,2 x HDMI,1 x DP,8GB memory pre-installed,12V DC,RoHS |
Package Contents
| Package Content |
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