» 6th/7th Gen Intel® Core™ processor platform with Intel® Q170 chipset and DDR4 memory
» Triple independent display with high resolution support
» Rich high-speed I/O interfaces on one side for easy installation
Hardware Spec.
Form factor | |
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SBC Form Factor |
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輸出/入介面 | |
I/O Ports |
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擴充槽 | |
擴充槽 |
PCIe Mini: 1 x Half-size PCIe Mini slot 1 x Full-size PCIe Mini slot (supports mSATA, colay with SATA) |
系統 | |
冷卻方式/系統風扇 | Fanless |
Drive Bays | 2 x 2.5“ SATA 6Gb/s HDD/SSD bay (RAID 0/1 support) |
指示燈與按鈕 | |
按鈕 |
1 x Power Button 1 x Reset Button 1 x AT/ATX Switch 1 x ACC Mode |
Physical Characteristics | |
Construction | Extruded aluminum alloys |
Color | |
Color | Black C + Silver |
Dimensions | |
Dimensions | 82.2 x 255.2 x 204 (WxDxH) (mm) |
Weight | |
Weight | 3.5 kg/4.5 kg |
Environment | |
Operating Temperature |
i7-6700TE -20°C ~ 45°C with air flow (SSD) i5-6500TE -20°C ~ 60°C with air flow (SSD) |
Humidity | 10% ~ 95%, non-condensing |
Ordering Information
TANK-871-Q170-i7/4G-R11 | Ruggedized Fanless embedded system with Intel® Core i7-6700TE 2.4GHz, (up to 3.4 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, VGA/HDMI+DP/iDP, 9~36V DC, Powder paint, RoHS |
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TANK-871-Q170-i5/4G-R11 | Ruggedized Fanless embedded system with Intel® Core i5-6500TE 2.3GHz, (up to 3.3 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, VGA/HDMI+DP/iDP, 9~36V DC, Powder paint, RoHS |
Package Contents
Package Content |
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