» 6th/7th Gen Intel® Core™ processor platform with Intel® Q170 chipset and DDR4 memory
» Triple independent display with high resolution support
» Rich high-speed I/O interfaces on one side for easy installation
» On-board internal power connector for providing power to add-on cards
» Great flexibility for hardware expansion
Hardware Spec.
Form factor | |
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SBC Form Factor |
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輸出/入介面 | |
I/O Ports |
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擴充槽 | |
擴充槽 |
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系統 | |
冷卻方式/系統風扇 | Fanless |
Drive Bays | 2 x 2.5" SATA 6Gb/s HDD/SSD bay (RAID 0/1 support) |
指示燈與按鈕 | |
按鈕 |
1 x Power Button 1 x Reset Button 1 x AT/ATX Switch 1 x ACC Mode |
Physical Characteristics | |
Construction | Extruded aluminum alloys |
Color | |
Color | Black C + Silver |
Dimensions | |
Dimensions |
2-slot: 121.5 x 255.2 x 205 (WxDxH) (mm) 4-slot: 154.8 x 255.2 x 205 (WxDxH) (mm) |
Weight | |
Weight |
2-slot: 4.2 kg/6.3 kg 4-slot: 4.5 kg/6.5 kg |
Environment | |
Operating Temperature |
i7-6700TE -20°C ~ 45°C with air flow (SSD) i5-6500TE -20°C ~ 60°C with air flow (SSD) |
Humidity | 10% ~ 95%, non-condensing |
Ordering Information
TANK-870-Q170-i7/4G/4A-R12 | Ruggedized Fanless embedded system with Intel® Core i7-6700TE 2.4GHz, (up to 3.4 GHz, 4-Core, TDP 35W), 4GB DDR4 pre-installed memory, 2 x PCIe by 8 & 2 x PCI expansion, VGA/HDMI+DP/iDP, 9~36V DC, Powder paint, RoHS |
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TANK-870-Q170-i7/4G/2B-R12 | Ruggedized Fanless embedded system with Intel® Core i7-6700TE 2.4GHz, (up to 3.4 GHz, 4-Core, TDP 35W), 4GB DDR4 pre-installed memory, 1 x PCIe by 16 & 1 x PCI expansion, VGA/HDMI+DP/iDP, 9~36V DC, Powder paint, RoHS |
TANK-870-Q170-i7/4G/2A-R12 | Ruggedized Fanless embedded system with Intel® Core i7-6700TE 2.4GHz, (up to 3.4 GHz, 4-Core, TDP 35W), 4GB DDR4 pre-installed memory, 2 x PCIe by 8 expansion, VGA/HDMI+DP/iDP, 9~36V DC, Powder paint, RoHS |
TANK-870-Q170-i5/4G/4A-R12 | Ruggedized Fanless embedded system with Intel® Core i5-6500TE 2.3GHz, (up to 3.3 GHz, 4-Core, TDP 35W), 4GB DDR4 pre-installed memory, 2 x PCIe by 8 & 2 x PCI expansion, VGA/HDMI+DP/iDP, 9~36V DC, Powder paint, RoHS |
TANK-870-Q170-i5/4G/2B-R12 | Ruggedized Fanless embedded system with Intel® Core i5-6500TE 2.3GHz, (up to 3.3 GHz, 4-Core, TDP 35W), 4GB DDR4 pre-installed memory, 1 x PCIe by 16 & 1 x PCI expansion, VGA/HDMI+DP/iDP, 9~36V DC, Powder paint, RoHS |
TANK-870-Q170-i5/4G/2A-R12 | Ruggedized Fanless embedded system with Intel® Core i5-6500TE 2.3GHz, (up to 3.3 GHz, 4-Core, TDP 35W), 4GB DDR4 pre-installed memory, 2 x PCIe by 8 expansion, VGA/HDMI+DP/iDP, 9~36V DC, Powder paint, RoHS |
Package Contents
Package Content |
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Marketing Material
All
Brochure
Video
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Brochure
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Video
- IEI Case Study|Facial Recognition System|AFL3|TANK-870 [English Version]
- IEI 成功案例分享|臉部辨識系統|AFL3|TANK-870 [Chinese Version]
- TANK系列嵌入式系統產品應用介紹 [Chinese Version]
- Introducing TANK series embedded system application stories [English Version]
- 工業電腦之工控用電腦 [Chinese Ver.]
- Industrial Automation System-Tank 800 Series [Eng Ver.]
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- IEI Case Study|Facial Recognition System|AFL3|TANK-870 [English Version]
- IEI 成功案例分享|臉部辨識系統|AFL3|TANK-870 [Chinese Version]
- TANK系列嵌入式系統產品應用介紹 [Chinese Version]
- Introducing TANK series embedded system application stories [English Version]
- 工業電腦之工控用電腦 [Chinese Ver.]
- Industrial Automation System-Tank 800 Series [Eng Ver.]