TANK-XM811AI-RPL AIoT Developer Kit
Powerful, Expandable and Reliable
The new series of AIoT developer kit - TANK-XM811AI-RPL AIoT Developer Kit is equipped with the 13th & 14th generation Intel® Core™ processor and the Intel® R680E chipset. This new processor
uses Intel® 7 process technology and offers up to 24 cores with 32 threads with Intel® Hybrid Technology for outstanding multi-threaded performance. The
TANK-XM811AI-RPL AIoT Developer Kit delivers low latency, high network, and data transmission speed with the support of PCI Express 4.0 for double throughput, and provides
optional Wi-Fi 6E capability. It has rich I/O design, including dual independent 4K display ports (HDMI and DP++), six COM ports, eight USB 3.2 Gen 2 ports, two
2.5GbE LAN ports, and also two PCIe x8 slots. Furthermore, it allows for extra I/O expansion cards, such as PoE LAN, M.2 A-Key or B-key to support various
applications at edge AI.
Additionally, the TANK-XM811AI-RPL AIoT Developer Kit is integrated with Intel® Iris® Xe graphics, which offers greater GPU computing performance and speed for users. Powered by Intel® Distribution of OpenVINO™ Toolkit and Intel® Arc® Graphics Card to improve AI performance, you can enjoy next-gen AI applications in automating business, inference computing, and data analysis.
13th & 14th Generation Intel® Core™
Processor (formerly Raptor Lake -S/ Raptor Lake –S Refresh)
Intel® Hybrid Technology
PCIe 4.0, 2.5GbE LAN, and USB 3.2 Gen 2
Modular Expansion with Rich I/O Design
Intel® Distribution of OpenVINO™ Toolkit and Intel® Arc® Graphics Card
Intel® Hybrid Technology
Intelligent Workload Optimization
Intel® Hybrid Technology consist of two core types, a combination of performance-cores (P-cores) and efficient-cores (E-cores) to optimize the single-thread (ST) and multi-thread (MT) performance of the CPU. Two cores are created with different power and performance characteristics to respond to different tasks. This architecture ensures higher workflow efficiency, lower power consumption, and operating temperature.
- Drive combined single-thread (ST) and multi-thread (MT) performance for IoT workloads
- P-cores cores drive single & lightly threaded performance enhancing IoT workloads
- E-cores cores enhance MT performance for background task management, multi-tasking, and focused MT throughput scenarios
Scalable and Expandable
Rich I/O Design with Optional I/O Modules
Supporting more AIoT solutions, the latest TANK-XM811AI-RPL AIoT Developer Kit brings eight USB 3.2 Gen 2 ports, six COM ports (RS-232/422/485), and two 2.5GbE LAN ports to integrate various sensors, IP cam and other devices. Further expansion capability is supported by two PCIe x8 slots for AI accelerator cards, PoE cards or a variety of add-on cards. Moreover, the TANK-XM811AI-RPL AIoT Developer Kit also provides extra I/O expansion modules, supporting more PoE LAN ports, M.2 A-Key/B-Key cards, or full-size mini PCIe modules for IT, system integrators (SI) and developers to create a comprehensive AIoT platform.
Intel® Distribution of OpenVINO™ Toolkit
Optimize Existing Models, Run Inference When You Need It
Intel® Distribution of OpenVINO™ Toolkit is based on convolutional neural networks (CNN); the toolkit extends workloads across multiple types of Intel® platforms and maximizes performance.
It can optimize pre-trained deep learning models such as Caffe, MXNET, and Tensorflow. The tool suite includes more than 20 pre-trained models, and supports 100+ public and custom models (including Caffe, MXNet, TensorFlow, ONNX, Kaldi) for easier deployments across Intel® silicon products (CPU, GPU, FPGA, VPU).
Who Needs It?
Computer Vision, Deep Learning Developers
Data Scientists
OEMs, ISVs, System Integrators
- Intel® Distribution of OpenVINO™ Toolkit
- Intel Edge Software Hub
- Edge Insights for Vision
Exploring Vision AI with TANK-XM811AI-RPL AIoT Developer Kit
Defect Classification of AOI
Vision AI supports production flow of a pilot run in a more accurate, automatic and intelligent way. It is applied particularly in automated optical inspection (AOI) for collaborating with robotics, IP cam or AGV applications to enhance production efficiency, quality, and safety.
The TANK AIoT Dev. Kit features rich I/O ports for connecting with numerous edge devices, and one PCIe 4.0 x8 slot for providing fast signal transmission speed with add-ons like the Intel® Arc® Graphics Card, graphic cards or PoE cards to optimize the performance on defects detection. The higher the accuracy of defects classification, the lower the cost and time spent on review and repair stations.
AI Surveillance Management in Factory
Security is a prerequisite in a factory to ensure the safety of employees and to maintain a productive environment. The TANK-XM811AI-RPL AIoT Developer Kit is designed with multiple USB ports, COM ports and LAN ports to support a numbers of IP channels or sensors. Combined with Intel® Distribution of OpenVINO™ Toolkit and the Intel® Arc® Graphics Card, the TANK-XM811AI-RPL AIoT Developer Kit can deliver powerful AI computing capability and image recognition to detect a worker's posture, monitor the restricted area or production line, and provide an alert and analytic result immediately. With the TANK-XM811AI-RPL AIoT Developer Kit, enterprises are able to maintain comprehensive and seamless security by addressing these concerns.
Fully integrated I/O
Front View
Rear View
Front View
Rear View
Dimensions (Unit: mm)
Specifications
Model | TANK-XM811AI-RPL AIoT Developer Kit |
Form Factor | |
Color | Black |
Dimension (W x D x H) | 137.9 x 255.4 x 230.6 mm |
Fan/Fanless | Fan |
Chassis Construction | Extruded aluminum alloys |
Motherboard | |
CPU | Intel® Core™ i9-13900TE 1.0GHz (up to 5.0GHz, 24-Core (8P+16E), TDP 35W) Intel® Core™ i7-13700TE 1.1GHz (up to 4.8GHz, 16-Core (8P+8E), TDP 35W) Intel® Core™ i9-14900T 1.1GHz (up to 5.1GHz, 24-Core (8P+16E), TDP 35W) Intel® Core™ i7-14700T 1.3GHz (up to 5.0GHz, 16-Core (8P+12E), TDP 35W) |
Chipset | Intel® R680E |
System Memory | 2 x SO-DIMM DDR4 3200MHz (2 x 16GB non-ECC Pre-installed, up to 64GB, support ECC SKU) |
Storage | |
Hard Drive | 13th(RPL): 1 x 2.5" HDD/SSD bay (256GB SSD pre-installed) 14th(RPL Refresh): 1 x 2.5" HDD/SSD bay (512GB SSD pre-installed) |
I/O Interfaces | |
Ethernet | 2 x RJ45: 1 x Intel I226LM 2.5GbE 1 x Intel I226-V 2.5GbE (Note:Previous motherboard version is I225 LM/-V 2.5GbE) |
USB 3.2 Gen 2 (10Gb/s) | 8 |
COM | 2 x RS-232/422/485 4 x RS-232 |
Digital I/O | 12-bit (6-in/6-out) |
Display | 1 x DP++ (up to 4096 x 2160@60Hz) 1 x HDMI (up to 4096 x 2160@30Hz) |
Expansion Slots | |
M.2 |
1 x 2230 A-key (PCIe x1/ USB2.0 support Intel® vPro) 1 x 2280 M-key (PCIe x4) |
Backplane | 2 x PCIe x8 slot (total power up to 75W, support FHHL card) |
Power | |
Power Input | DC Jack: 12V ~ 28V DC Terminal Block: 12V ~ 28V DC |
Remote Power | Terminal Block: 2-Pin |
Reliability | |
Mounting | Wall mount |
Operating Temperature | -20°C ~ 60°C with air flow (with SSD), 10% ~ 95%, non-condensing |
Storage Temperature | -40°C ~ 80°C, 10% ~ 95%, non-condensing |
Operating Shock | Half-sine wave shock 5G, 11ms, 100 shocks per axis (with SSD) |
Operation Vibration | MIL-STD-810G 514.6C-1 (with SSD) |
Weight (Net / Gross) | 4.6kg / 5.6kg |
Safety / EMC | CE / FCC |
Watchdog Timer | Programmable 1 ~ 255 sec/min |
OS | |
Supported OS | Windows® 10 IoT Enterprise / Linux |
Ordering Information
Part No. | Description |
TANK-XM811AI-RPL01/2A-R10 | Ruggedized embedded system with Intel® Core™ i9-13900TE processor, 2 x 16GB DDR4 pre-installed, 2 x PCIe x8 expansion, 2.5” 256GB SSD, 12~28V DC, 180W AC DC power adapter, RoHS |
TANK-XM811AI-RPL02/2A-R10 | Ruggedized embedded system with Intel® Core™ i7-13700TE processor, 2 x 16GB DDR4 pre-installed, 2 x PCIe x8 expansion, 2.5” 256GB SSD, 12~28V DC, 180W AC DC power adapter, RoHS |
TANK-XM811AI-RPLR01/2A-R10 | Ruggedized embedded system with Intel® Core™ i9-14900T processor, 2 x 16GB DDR4 pre-installed, 2 x PCIe x8 expansion, 2.5" 512GB SSD, 12~28V DC, 180W AC DC power adapter, RoHS |
TANK-XM811AI-RPLR02/2A-R10 | Ruggedized embedded system with Intel® Core™ i7-14700T processor, 2 x 16GB DDR4 pre-installed, 2 x PCIe x8 expansion, 2.5" 512GB SSD, 12~28V DC, 180W AC DC power adapter, RoHS |
Wi-Fi Kit Options
Part No. | Description |
EMB-WIFI-KIT02I3-R10 | 2T2R M.2 wifi module kit for embedded system, IEEE 802.11a/b/g/n/ac/ax, 1 x M.2 AE Key Wireless LAN & Bluetooth 5.2, Intel® Wi-Fi 6E AX210 Module (AX210.NGWG), 2 x RF cable , 2 x Antenna; RoHs |
Packing List
1 x Mounting Screw | 1 x Wall Mounting Kit | 1 x Quick Start Guide | 1 x 180W power adapter | 1 x Power Cord |
Notices: Intel, the Intel logo, Intel Core, Intel® Arc® Graphics, and Myriad are trademarks of Intel Corporation or its subsidiaries.