TANK-XM811AI-RPL AIoT Developer Kit

Powerful, Expandable and Reliable

The new series of AIoT developer kit - TANK-XM811AI-RPL AIoT Developer Kit is equipped with the 13th & 14th generation Intel® Core™ processor and the Intel® R680E chipset. This new processor uses Intel® 7 process technology and offers up to 24 cores with 32 threads with Intel® Hybrid Technology for outstanding multi-threaded performance. The TANK-XM811AI-RPL AIoT Developer Kit delivers low latency, high network, and data transmission speed with the support of PCI Express 4.0 for double throughput, and provides optional Wi-Fi 6E capability. It has rich I/O design, including dual independent 4K display ports (HDMI and DP++), six COM ports, eight USB 3.2 Gen 2 ports, two 2.5GbE LAN ports, and also two PCIe x8 slots. Furthermore, it allows for extra I/O expansion cards, such as PoE LAN, M.2 A-Key or B-key to support various applications at edge AI.
Additionally, the TANK-XM811AI-RPL AIoT Developer Kit is integrated with Intel® Iris® Xe graphics, which offers greater GPU computing performance and speed for users. Powered by Intel® Distribution of OpenVINO™ Toolkit and Intel® Arc® Graphics Card to improve AI performance, you can enjoy next-gen AI applications in automating business, inference computing, and data analysis.

TANK-XM811
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13th & 14th Generation Intel® Core™
Processor (formerly Raptor Lake -S/ Raptor Lake –S Refresh)

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Intel® Hybrid Technology

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PCIe 4.0, 2.5GbE LAN, and USB 3.2 Gen 2

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Modular Expansion with Rich I/O Design

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Intel® Distribution of OpenVINO™ Toolkit and Intel® Arc® Graphics Card

Intel® Hybrid Technology

Intelligent Workload Optimization

Intel® Hybrid Technology consist of two core types, a combination of performance-cores (P-cores) and efficient-cores (E-cores) to optimize the single-thread (ST) and multi-thread (MT) performance of the CPU. Two cores are created with different power and performance characteristics to respond to different tasks. This architecture ensures higher workflow efficiency, lower power consumption, and operating temperature.

  • Drive combined single-thread (ST) and multi-thread (MT) performance for IoT workloads
  • P-cores cores drive single & lightly threaded performance enhancing IoT workloads
  • E-cores cores enhance MT performance for background task management, multi-tasking, and focused MT throughput scenarios
Intel® Hybrid Technology

Intel® Hybrid Technology

Improving IoT Workflow

Improving IoT Workflow

Saving Power

Saving Power

Scalable and Expandable

Rich I/O Design with Optional I/O Modules

Supporting more AIoT solutions, the latest TANK-XM811AI-RPL AIoT Developer Kit brings eight USB 3.2 Gen 2 ports, six COM ports (RS-232/422/485), and two 2.5GbE LAN ports to integrate various sensors, IP cam and other devices. Further expansion capability is supported by two PCIe x8 slots for AI accelerator cards, PoE cards or a variety of add-on cards. Moreover, the TANK-XM811AI-RPL AIoT Developer Kit also provides extra I/O expansion modules, supporting more PoE LAN ports, M.2 A-Key/B-Key cards, or full-size mini PCIe modules for IT, system integrators (SI) and developers to create a comprehensive AIoT platform.

Scalable and Expandable

Intel® Distribution of OpenVINO™ Toolkit

Optimize Existing Models, Run Inference When You Need It

Intel® Distribution of OpenVINO™ Toolkit is based on convolutional neural networks (CNN); the toolkit extends workloads across multiple types of Intel® platforms and maximizes performance.

It can optimize pre-trained deep learning models such as Caffe, MXNET, and Tensorflow. The tool suite includes more than 20 pre-trained models, and supports 100+ public and custom models (including Caffe, MXNet, TensorFlow, ONNX, Kaldi) for easier deployments across Intel® silicon products (CPU, GPU, FPGA, VPU).

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High Performance AI at the Edge

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Streamlined & Optimized Deep Learning Inference

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Heterogeneous, Cross-Platform Flexibility

Who Needs It?

Computer Vision, Deep Learning Developers

Data Scientists

OEMs, ISVs, System Integrators

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  • Intel® Distribution of OpenVINO™ Toolkit
  • Intel Edge Software Hub
  • Edge Insights for Vision

Exploring Vision AI with TANK-XM811AI-RPL AIoT Developer Kit

Defect Classification of AOI

Vision AI supports production flow of a pilot run in a more accurate, automatic and intelligent way. It is applied particularly in automated optical inspection (AOI) for collaborating with robotics, IP cam or AGV applications to enhance production efficiency, quality, and safety.
The TANK AIoT Dev. Kit features rich I/O ports for connecting with numerous edge devices, and one PCIe 4.0 x8 slot for providing fast signal transmission speed with add-ons like the Intel® Arc® Graphics Card, graphic cards or PoE cards to optimize the performance on defects detection. The higher the accuracy of defects classification, the lower the cost and time spent on review and repair stations.

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TANK-XM811AI-RPL
AIoT Developer Kit

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AI Surveillance Management in Factory

Security is a prerequisite in a factory to ensure the safety of employees and to maintain a productive environment. The TANK-XM811AI-RPL AIoT Developer Kit is designed with multiple USB ports, COM ports and LAN ports to support a numbers of IP channels or sensors. Combined with Intel® Distribution of OpenVINO™ Toolkit and the Intel® Arc® Graphics Card, the TANK-XM811AI-RPL AIoT Developer Kit can deliver powerful AI computing capability and image recognition to detect a worker's posture, monitor the restricted area or production line, and provide an alert and analytic result immediately. With the TANK-XM811AI-RPL AIoT Developer Kit, enterprises are able to maintain comprehensive and seamless security by addressing these concerns.

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TANK-XM811AI-RPL
AIoT Developer Kit

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Fully integrated I/O

Front View

Rear View

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Front View

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Rear View

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Dimensions (Unit: mm)

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Specifications

Model TANK-XM811AI-RPL AIoT Developer Kit
Form Factor
Color Black
Dimension (W x D x H) 137.9 x 255.4 x 230.6 mm
Fan/Fanless Fan
Chassis Construction Extruded aluminum alloys
Motherboard
CPU Intel® Core™ i9-13900TE 1.0GHz (up to 5.0GHz, 24-Core (8P+16E), TDP 35W)
Intel® Core™ i7-13700TE 1.1GHz (up to 4.8GHz, 16-Core (8P+8E), TDP 35W)
Intel® Core™ i9-14900T 1.1GHz (up to 5.1GHz, 24-Core (8P+16E), TDP 35W)
Intel® Core™ i7-14700T 1.3GHz (up to 5.0GHz, 16-Core (8P+12E), TDP 35W)
Chipset Intel® R680E
System Memory 2 x SO-DIMM DDR4 3200MHz (2 x 16GB non-ECC Pre-installed, up to 64GB, support ECC SKU)
Storage
Hard Drive 13th(RPL): 1 x 2.5" HDD/SSD bay (256GB SSD pre-installed)
14th(RPL Refresh): 1 x 2.5" HDD/SSD bay (512GB SSD pre-installed)
I/O Interfaces
Ethernet 2 x RJ45:
1 x Intel I226LM 2.5GbE
1 x Intel I226-V 2.5GbE
(Note:Previous motherboard version is I225 LM/-V 2.5GbE)
USB 3.2 Gen 2 (10Gb/s) 8
COM 2 x RS-232/422/485
4 x RS-232
Digital I/O 12-bit (6-in/6-out)
Display 1 x DP++ (up to 4096 x 2160@60Hz)
1 x HDMI (up to 4096 x 2160@30Hz)
Expansion Slots
M.2 1 x 2230 A-key (PCIe x1/ USB2.0 support Intel® vPro)
1 x 2280 M-key (PCIe x4)
Backplane 2 x PCIe x8 slot (total power up to 75W, support FHHL card)
Power
Power Input DC Jack: 12V ~ 28V DC
Terminal Block: 12V ~ 28V DC
Remote Power Terminal Block: 2-Pin
Reliability
Mounting Wall mount
Operating Temperature -20°C ~ 60°C with air flow (with SSD), 10% ~ 95%, non-condensing
Storage Temperature -40°C ~ 80°C, 10% ~ 95%, non-condensing
Operating Shock Half-sine wave shock 5G, 11ms, 100 shocks per axis (with SSD)
Operation Vibration MIL-STD-810G 514.6C-1 (with SSD)
Weight (Net / Gross) 4.6kg / 5.6kg
Safety / EMC CE / FCC
Watchdog Timer Programmable 1 ~ 255 sec/min
OS
Supported OS Windows® 10 IoT Enterprise / Linux

Ordering Information

Part No. Description
TANK-XM811AI-RPL01/2A-R10 Ruggedized embedded system with Intel® Core™ i9-13900TE processor, 2 x 16GB DDR4 pre-installed, 2 x PCIe x8 expansion, 2.5” 256GB SSD, 12~28V DC, 180W AC DC power adapter, RoHS
TANK-XM811AI-RPL02/2A-R10 Ruggedized embedded system with Intel® Core™ i7-13700TE processor, 2 x 16GB DDR4 pre-installed, 2 x PCIe x8 expansion, 2.5” 256GB SSD, 12~28V DC, 180W AC DC power adapter, RoHS
TANK-XM811AI-RPLR01/2A-R10 Ruggedized embedded system with Intel® Core™ i9-14900T processor, 2 x 16GB DDR4 pre-installed, 2 x PCIe x8 expansion, 2.5" 512GB SSD, 12~28V DC, 180W AC DC power adapter, RoHS
TANK-XM811AI-RPLR02/2A-R10 Ruggedized embedded system with Intel® Core™ i7-14700T processor, 2 x 16GB DDR4 pre-installed, 2 x PCIe x8 expansion, 2.5" 512GB SSD, 12~28V DC, 180W AC DC power adapter, RoHS

Wi-Fi Kit Options

Part No. Description
EMB-WIFI-KIT02I3-R10 2T2R M.2 wifi module kit for embedded system, IEEE 802.11a/b/g/n/ac/ax, 1 x M.2 AE Key Wireless LAN & Bluetooth 5.2, Intel® Wi-Fi 6E AX210 Module (AX210.NGWG), 2 x RF cable , 2 x Antenna; RoHs

Packing List

1 x Mounting Screw 1 x Wall Mounting Kit 1 x Quick Start Guide 1 x 180W power adapter 1 x Power Cord

Notices: Intel, the Intel logo, Intel Core, Intel® Arc® Graphics, and Myriad are trademarks of Intel Corporation or its subsidiaries.