TANK-XM811 ADL DG Developer Kit
Powerful, Expandable and Reliable
TANK-XM811 ADL DG Developer Kit is equipped with the 12th generation Intel® Core™ processor and the Intel® R680E chipset. This processor uses Intel® 7 process technology and offers up to 16 cores and 24 threads with Intel® Hybrid Technology for outstanding multi-threaded performance.
The TANK-XM811 ADL DG Developer Kit delivers low latency, high network, and data transmission speed with the support of PCI Express 4.0 for double throughput and provides optional Intel® Wi-Fi 6E. It has a rich I/O design, including dual independent 4K display ports (HDMI and DP++), six COM ports, eight USB 3.2 Gen 2 ports, two 2.5GbE LAN ports, and two PCIe x8 slots. Furthermore, it allows extra I/O expansion cards, such as PoE LAN, M.2 A-Key, or B-key, to support various applications at edge AI.
Additionally, the TANK-XM811 ADL DG Developer Kit is also powered by the latest professional workstation GPU from Intel: Intel® Arc™ Pro A40 GPU, providing graphics acceleration, and machine learning capabilities, supports up to four ultra-large displays, and more memory in a tiny form factor, which offers more extraordinary GPU computing performance and speed for users.
Integrate with Intel® OpenVINO™ Toolkit and Intel® Arc™ Pro A-Series Graphics to improve AI performance. The developer can enjoy next-gen AI applications in automating business, inference computing, and data analysis.
12th Generation Intel® Core™
Processor (formerly Alder Lake-S)
Intel® Hybrid Technology
PCIe 4.0, 2.5GbE LAN, and USB 3.2 Gen 2
Modular Expansion with Rich I/O Design
Intel® Distribution of OpenVINO™ Toolkit and Intel® Arc™ Pro A-Series Graphics
Intel® Hybrid Technology
Intelligent Workload Optimization
Intel® Hybrid Technology consist of two core types, a combination of performance-cores (P-cores) and efficient-cores (E-cores) to optimize the single-thread (ST) and multi-thread (MT) performance of the CPU. Two cores are created with different power and performance characteristics to respond to different tasks. This architecture ensures higher workflow efficiency, lower power consumption, and operating temperature.
- Drive combined single-thread (ST) and multi-thread (MT) performance for IoT workloads
- P-cores cores drive single & lightly threaded performance enhancing IoT workloads
- E-cores cores enhance MT performance for background task management, multi-tasking, and focused MT throughput scenarios
Intel® Hybrid Technology
Improving IoT Workflow
Saving Power
Scalable and Expandable
Rich I/O Design with Optional I/O Modules
Supporting more AIoT solutions, the latest TANK-XM811 ADL DG Developer Kit brings eight USB 3.2 Gen 2 ports, six COM ports (RS-232/42 2/485), and two 2.5GbE LAN ports to integrate various sensors, IP cam and other devices. It's expansion capability is supported by two PCIe x8 slots for AI accelerator cards, PoE cards or a variety of add-on cards. Moreover, the TANK-XM811 ADL DG Developer Kit also provides extra I/O expansion modules, supporting more PoE LAN ports, M.2 A-Key/B-Key cards, or full-size PCIe Mini modules for IT, system integrators (SI) and developers to create a comprehensive AIoT platform.
Intel® Distribution of OpenVINO™ Toolkit
Optimize Existing Models, Run Inference When You Need It
Intel® Distribution of OpenVINO™ Toolkit is based on convolutional neural networks (CNN); the toolkit extends workloads across multiple types of Intel® platforms and maximizes performance.
It can optimize pre-trained deep learning models such as Caffe, MXNET, and Tensorflow. The tool suite includes more than 20 pre-trained models, and supports 100+ public and custom models (including Caffe, MXNet, TensorFlow, ON NX, Kaldi) for easier deployments across Intel® silicon products (CPU, GPU, FPGA, VPU).
High Performance AI at the Edge
Streamlined & Optimized Deep Learning Inference
Heterogeneous,Cross-Platform Flexibility
Who Needs It?
Computer Vision, Deep Learning Developers
Data Scientists
OEMs, ISVs, System Integrators
- 3.50 TFLOPs at Single Precision
- PCIe 4.0 x8, with Common 3.0 Backwards Compatibility
- 8x Ray Trace Cores
- 6GB GDDR6
- 4x mini-DP 2.0 Ready with Audio Support
- 50w Peak Power in a Single Slot Form Factor
IEI Hands-On Lab / Installation Guide
- Sample cases using Developer Kit
- Installation guide More info about IEI Hands-On Lab
Exploring Vision AI with TANK-XM811 ADL DG Developer Kit
Defect Classification of AOI
Vision AI supports production flow of a pilot run in a more accurate, automatic and intelligent way. It is particularly applied in automated optical inspection (AOI) for collaborating with robotics, IP cam or AGV applications to enhance production efficiency, quality, and safety.
The TANK DG Dev. Kit features rich I/O ports for connecting with numerous edge devices, and one PCIe 4.0 x8 slots for providing fast signal transmission speed with add-ons Intel® Arc™ Pro A-Series Graphics, or optional PoE cards to optimize the performance on defects detection. The higher the accuracy of defects classification, lower the cost and time spent on review and repair stations.
AI Surveillance Management in Factory
Security is a prerequisite in a factory to ensure the safety of employees and to maintain a productive environment. The TANK-XM811 ADL DG Developer Kit is designed with multiple USB ports, COM ports and LAN ports to support a numbers of IP channels or sensors. Combined with Intel® OpenVINO Toolkit and Intel® Arc™ Pro A-Series Graphics, the TANK-XM811 ADL DG Developer Kit can deliver powerful AI computing capability and image recognition to detect a worker's posture, monitor the restriction area or production line, and provide an alert and analytic result immediately. With the TANK-XM811 ADL DG Developer Kit, enterprises are able to maintain comprehensive and seamless security by addressing all the concerns.
Fully integrated I/O
Front View
Rear View
Front View
Rear View
Dimensions (Unit: mm)
Specifications
| Model | TANK-XM811 ADL DG Developer Kit |
| Form factor | |
| Color | Black C |
| Dimension (WxDxH) | 137.9 x 255.4 x 230.6 mm |
| Cooling | Fan (in expansion chasses) |
| Chassis Construction | Extruded aluminum alloys |
| Motherboard | |
| CPU | Intel® Core™ i5-12500TE 1.9GHz (up to 4.3GHz, 6-Core, TDP 35W) |
| Chipset | Intel® R680E |
| System Memory | 2 x SO-DIMM DDR4 3200MHz (2 x 8GB non-ECC Pre-installed, up to 64GB, support ECC SKU) |
| Storage | |
| Drive Bays | 1 x 2.5" HDD/SSD bay (256GB SSD pre-installed) |
| External I/O | |
| Ethernet | 2 x RJ45: 1 x Intel® I225LM 2.5GbE 1 x Intel® I225V 2.5GbE |
| USB 3.2 Gen2 (10Gb/s) | 8 |
| Serial I/O | 2 x RS-232/422/485 4 x RS-232 |
| Digital I/O | 12-bit (6-in/6-out) |
| Display outputs (Integrated Graphics) | 1 x DP++ (up to 4096 x 2160@60Hz) 1 x HDMI (up to 4096 x 2160@30Hz) |
| Internal Expansions | |
| M.2 |
1 x 2230 A-key (PCIe 3.0 x1/ USB2.0 support Intel® vPro) 1 x 2280 M-key (PCIe 3.0 x4) |
| Backplane | 1 x PCIe 4.0 x16 (PCIe x8 signal) - support dual slot card 1 x PCIe 4.0 x16 (PCIe x8 signal) - Intel Arc Pro A40 pre-installed (Maximum total 75W for add-on card power consumption and support FHHL card) |
| Power | |
| Power Input | DC Jack: 12V ~ 28V DC Terminal Block: 12V ~ 28V DC |
| Remote Power | Terminal Block: 2-Pin |
| Reliability | |
| Mounting | Wall mount |
| Operating Temperature | 0°C ~ 40°C with air flow (SSD + Discrete Graphics) |
| Operating Shock | Half-sine wave shock 5G, 11ms, 100 shocks per axis (with SSD + Discrete Graphics) |
| Operating Vibration | MIL-STD-810G 514.6C1 (with SSD + Discrete Graphics) |
| Weight (Net / Gross) | 5.02 kg/ 6.02 kg |
| Safety / EMC | CE / FCC |
| Watchdog Timer | Programmable 1 ~ 255 sec/min |
| OS | |
| Supported OS | Windows® 10/11 IoT Enterprise / Linux (Ubuntu 22.04 IoT) |
Ordering Information
| Part No. | Description |
| TANK-XM811AI-i5AD/2A-A40-R10 | Ruggedized embedded system with Intel® Core™ i5-12500TE 1.9GHz, (up to 4.3GHz, 6-Core, TDP 35W), 2 x 8GB DDR4 pre-installed, Intel® Arc™ Pro A40 pre-installed, 2.5" 256 SSD, 12~28V DC, 180W AC DC power adapter, RoHS |
Wi-Fi Kit Options
| Part No. | Description |
| EMB-WIFI-KIT02I3-R10 | 2T2R M.2 wifi module kit for embedded system, IEEEE802.11a/b/g/n/ac/ax, 1 x M.2 AE Key Wireless LAN & Bluetooth 5.2;Intel;AX210.NGWG Module, 2 x RF cable , 2 x Antenna; RoHs |
Packing List
| 1 x Mounting Screw | 1 x Wall Mounting Kit | 1 x QSG | 1 x 180W Adapter | 1 x Power Cord |
