Overview
Hardware Features
Ready-to-Run, Hard Real-Time Computing
Applications
Hardware Overview
Specifications
Optimizing AI Inference, Easy AI Deployment, Hard Real-Time Computing
IEI DRPC TSN/TCC Developer Kit is a compact yet powerful industrial grade embedded system that lets you easily optimize and deploy AI inference at the rugged edge. It is ready-to-use, simple to get started, and is equipped with what you need—11th Gen Intel® Core™ i5 processor, 8GB DDR4 memory, 256GB SSD, and Yocto Project® OS image—to deploy your AI solutions quickly and easily. Moreover, this developer kit makes real-time computing a basic feature in simplifying time-sensitive application design for device manufacturers.
High AI Inference Capability
The 11th Gen Intel® Core™ i5 processor comes with Intel® Iris® Xe graphics, of up to 96 graphics EUs, and boosts high AI performance at 4.15 TFLOPS and 8.29 TOPS.
Built for Ruggedness
The ruggedness and durable design of the developer kit has been tested by IEI’s experienced engineers under harsh environments as defined by the MIL-STD standard, in our qualified laboratory.
Scalability with Modular Expansion Design
The modular PCIe x4 expansion capability allows add-ons of interface cards. The four 2.5GbE ports are capable of delivering PoE power with optional power modules.
Integrated Yocto Image
IEI helps ease this burden on OS development and provides a reliable embedded Yocto Project® OS image.
Hard Real-Time Compute
The DRPC TSN/TCC Developer Kit supports both Intel® Time Coordinated Computing (Intel® TCC) and Time Sensitive Networking (TSN) for Time-Critical Performance. These technologies assure accurate and stable delay time for critical real-time data across the network.
Powered by 11th Gen Intel® Processor
The DRPC TSN/TCC Developer Kit is powered by the 11th Gen Intel® Core™ i5 processor for a balance of performance and responsiveness in a low-power platform. The 11th Gen Intel® Core™ processor is up to 23% faster in single-thread performance and up to 19% faster in multi-thread performance than its prior generation for smoother handling of intensive computing tasks. The processor is optimized for real-time featuring Intel® Time Coordinated Computing (Intel® TCC) and can also be paired with Intel Ethernet controller i225/i226 Series with TSN. With the new Intel® Iris® Xe graphics architecture, the GPU is integrated with 80EUs and gains 2.95x the graphics performance over the 8th generation Intel® Core™ processors.
* Get Started with an Intel®-Based Developer Kit Preinstalled with Edge Insights for Vision
Versatile, Space-Saving Design for Flexible Installation
IEI DRPC TSN/TCC Developer Kit measures just 190 x 150 x 80mm, so it takes up very little room to help you maintain a clutter-free workspace. Its DIN-rail mounting support enables the system to be used across space-critical industries and workplace environments. With a compact size and rubber foot pads provided, the DRPC TSN/TCC Developer Kit is also perfect for set-top box use.
Industrial-Grade Hardened Hardware Design with 12V~28V DC Wide-Range Power Input
Ruggedized hardware architecture safeguards the small form factor developer kit in harsh, remote and dynamic environments.
» Fanless cooling eliminates failure points
» -20°C to 60°C wide operating temperature
» 50G shock and 3 Grms vibration tolerance
» Wide 12V to 28V DC voltage input
» Intel® Platform Trust Technology (Intel® PTT) to enable password protection, device authentication and future-ready cybersecurity
-20°C
60°C
Fanless System with Reliable Thermal Design
The DRPC TSN/TCC Developer Kit's thermal design is optimized for better heat conduction using a pin-fin heatsink concept. This enhances two dimensional heat conduction and reduces flow impedance for better heat dissipation in this fan-less system. The overall weight is thus reduced by 35%, significantly enhancing system reliability in vibration-sensitive applications, such as AGV (Automated Guided Vehicle). Moreover, this innovative thermal design allows the DRPC TSN/TCC Developer Kit to maximize superior performance compared with others that use traditional plate heatsink consisting of parallel fins.
Lightweight & Thin Cooling Solution
Stackable, Modular PCIe x4 Design for Added Functionality
Adding an optional second stack expansion kit, TXC-DRPC TSN/TCC Developer Kit-1S-R10, enables the DRPC TSN/TCC Developer Kit to have flexible functionality for installing a variety of PCIe x4 add-on cards, such as high density I/O cards, vision cards, motion cards and AI accelerators, according to specific application requiremetns via simple and reliable board-to-board conections.
Quad Port 2.5 Gigabit Ethernet with PoE Power
The DRPC TSN/TCC Developer Kit has four 2.5GbE RJ-45 ports to meet the requirements of bandwidth-demanding applications. In addition, the DRPC TSN/TCC Developer Kit is compliant with the IEEE 802.3af PoE standard and offers 4-port 15.4-watt PoE capabilities with the optional PoE power module (GPOE DRPC TSN/TCC Developer Kit), which transforms all of the four 2.5GbE ports to be PoE capable.
The DRPC TSN/TCC Developer Kit can supply a total power budget of 60 watts to meet the demands of many power devices (PDs) (such as IP cameras, wireless APs, IP phones and LED lights).
Wireless Connectivity and AI Accelerating for Edge Telemetry
The DRPC TSN/TCC Developer Kit enables seamless wireless connectivity and AI acceleration for remote and mobile edge deployments. » 4G/LTE with the M.2 3042 B key slot with SIM socket on board (USB 3.2 Gen 1/USB 2.0 mode) or AI accelerator by M.2 3080 B key slot (PCIe x2 mode) » Wi-Fi & Bluetooth by M.2 2230 A key slot (PCIe x1 and USB 2.0 mode)
Hard real-time is necessary in areas such as robotics, automotive, and utilities where a capability fails if it cannot be executed within the allotted time span. To achieve the stringent real-time computing requirements, the DRPC TSN/TCC Developer Kit supports both Intel® Time Coordinated Computing (Intel® TCC) and Time-Sensitive Networking (TSN) to assure accurate and stable delay time for critical real-time data across the network.
TSN and Intel® TCC are two complementary technologies for real-time communication over IP. TSN defines a set of standards for how time sensitive data is transmitted over Ethernet networks. Intel® TCC reduces jitter and improves performance for latency sensitive applications.
* Hardware and Software for Real-Time Computing
Intel® TCC/TSN Features
• Intel® Time Coordinated Computing Tools (Intel® TCC) Overview
• Time Sensitive Networking (TSN)
• Intel® Time Coordinated Computing Tools (Intel® TCC Tools) Developer Guide
• Real-Time Tuning Guide for 11th Generation Intel® Core™ Processors
Intel Edge Software Reference
• Intel® Edge Software Hub
• Intel® Edge Controls for Industrial (Intel® ECI)
To have a precise time synchronization between devices, the RS-232 port on DRPC-240 developer kit has Time-Aware GPIO (TGPIO) allowing you to control devices using timestamps.
Time-Aware GPIO (TGPIO) Samples
Making real-time computing a basic feature of DRPC TSN/TCC Developer Kit simplifies design and manufacturing for device manufacturers. It also creates new possibilities for critical, time-sensitive applications.
Autonomous Mobile Robots
Making real-time computing a basic feature of DRPC AIoT Developer Kit simplifies design and manufacturing for device manufacturers. It also creates new possibilities for critical, time-sensitive applications.
Learn more...
Industrial Automation
Integrate video and time-series data analytics on edge compute nodes for industrial use cases using prevalidated software components.
Computer Vision
Deploy computer vision and deep learning workloads at the edge with prevalidated software components.
With flexibility and convenience – various options await! Build your iconic DRPC TSN/TCC Developer Kit by choosing functional expasions!
Mustang-V100-MX8
8 x Intel® Movidius™ Myriad™ X MA2485 VPU Accelerator
Mustang-V100-MX4
4 x Intel® Movidius™ Myriad™ X MA2485 VPU Accelerator
GPOE-2P
2-port 802.3at PoE Card
We will empower you every step of the way
Technical Support & Feedback
Sample Request
This site uses cookies in order to improve your user experience and to provide content tailored specifically to your interests. By continuing to browse our site you agree to our use of cookies, Data Privacy Notice and Terms of Use.
Accept
