» 支持 12/13代 Intel® mobile Alder Lake-P/Raptor Lake-P 板载 SoC
» 板载 LPDDR4x 3200 MHz 8GB内存，内存上限为 32GB
» 支持两路 HDMI™、两路 DP，四路独立显示
» 支持 PCIe X4、M.2 M key、M.2 B key和M.2 A key扩展
» 支持两个 2.5GbE 网口，使用 Intel® I225V/I226V 网络芯片
Overview
The WAFER-ADL-P is a 3.5-inch single-board computer designed to seamlessly work with 12th/13th Intel® Core™ i7/i5/i3 and Celeron® mobile processors. It comes with a reliable 8GB LPDDR4x on-board memory, typically used in high-vibration and shock environments. The quadruple 4K display connection makes the board ideal for digital signage, surveillance, maintenance, or monitoring usage. The PCIe x4 expansion offers additional extensive I/O and function expansion capabilities. To summarize, the WAFER-ADL-P is compact but versatile, able to adapt to various IoT applications such as surveillance, EV charging stations, AMR, and smart energy management
12th/13th Gen Intel® Core™
Mobile Processors
4K Quadruple
Independent Display
PCIe x4
Expansion
Well-Design
IHCC Thermal Solution
Dual Intel®
2.5G Ethernet
Three M.2 Slots
High-performance 12th/13th Gen Intel Core Mobile Processors
The WAFER-ADL-P Series is powered by the 12th/13th Gen Intel Core Mobile Processors for powerful 5-core to 10-core performance with efficient system power consumption. Furthermore, it leverages the breakthrough Performance Hybrid Architecture for dramatic increases to single- and multi-threaded performance combined with graphics density and AI acceleration in small form factor but high-performance designs.
4K Quadruple Independent Displays
The WAFER-ADL-P integrates Intel® Iris® Xe Graphics, delivering up to 2.47x faster graphics performance compared to 11th Gen Intel Core processors. With Intel® Iris® Xe Graphics, the board can feature up to 96 graphics EUs and also provide up to four concurrent 4K independent displays. This is ideal for video wall and surveillance applications.
PCIe x4 Expansion Allows Extensive I/O and Function Expansion
Outwards-facing Expansions
Inwards-facing Expansions
PCIe x4 Interface Card Expansion
Outwards-facing
Expansions:
Two PCIe x1 / One PCIe
x2
The outwards-facing riser card, NWR-L2S, enables the connection of up to two outwards-facing PCIe x1 slots via one PCI Express interface. Although may take up more space, it can help enhance the airflow and heat transfer within the system. It is ideal for the chassis that is wide enough for the expansion card to be placed.
Inwards-facing
Expansions:
Two PCIe x1 / One PCIe
x2
The inwards-facing riser card, NWR-R2S, enables the connection of up to two inwards-facing PCIe x1 slots via one PCI Express interface. It is suitable for installation where space is limited. With higher height to increase spacing between boards, it can ensure efficient heat dissipation for space-constrained applications.
PCIe x4 Interface Card Expansion
The PCIe Gen3 x4 (x2 signal) slot, providing high-speed data transfer rate of up to 2GB/s, allows for additional customization and expansion. Directly installing a PCIe card enables the motherboard to run more complex and challenging tasks at the edge.
Enhanced Stability and Easy Installation
Both of the riser cards can be firmly secured to enhance stability by using the L-shaped bracket, in which screw holes are perfectly matched with those on the side of the heat spreader to make it simple and easy to install.
Well-Design Thermal Solution
IEI Heat Conduction Casing (IHCC)
Diverse Mounting
Fitting Different Mounting Needs
IEI Heat Conduction Casing (IHCC)
IEI has developed a highly
efficient thermal solution
for the 3.5" SBC - the IEI
Heat Conduction Casing
(IHCC). The IHCC effectively
enhances heat transfer
performance by targeting the
primary heat source, thus
eliminating the need for
designing a separate heat
spreader.
The IHCC consists of a
casing and a heat conduction
block that securely fits
over the key components
where the major heat is
generated, ensuring optimal
heat transfer.
Diverse Mounting Options
With its well-design thurmal casing, WAFER-ADL-P provides complete 13 holes on three sides. It can be conveniently mounted on the back panel, door, or DIN rail of a control cabinet. Moreover, installing an extra thermal module for optimal performance in elevated ambient temperatures is a straightforward process.
Fitting different mounting needs
Catering to various mounting requirements, such as Embedded System, Electrical Cabinet, and the versatile stacking of Flexible Thermal Modules.
Dual Low-Latency 2.5G LAN Powered by Intel
2.5 GbE allows for different connection speeds ranging from 100 Mbps to 2.5 Gbps on Cat6 and Cat 5e cables, enabling users to fully utilize high-performance network solutions without costly cable upgrades.
M.2 Expansion for Wi-Fi and NVMe Storage
M.2 2230 A Key for Wi-Fi/Bluetooth
The M.2 2230 A key slot, carrying PCIe Gen3 x1 and USB 2.0 signals, allows it to adopt the latest Wi-Fi 6E technology. Wi-Fi 6E enhances low latency and supports service levels equivalent to 5G networks.
M.2 3042 B Key Slot for LTE & 4G
The M.2 3042 B key slot has PCIe Gen3 x1 and USB 2.0 signals. With an on-board SIM card socket, it become effortless to integrate LTE/4G wireless connectivity. This enables seamless access to fast cellular networks and advanced communication technologies.
M.2 2242/80 M Key for Fast Transfer Speed NVMe SSD Storage
The configurable M.2 2242/80 M key slot supports high-speed PCIe Gen3 x4 3.94 GB/s, making the NVMe SSD twice as fast as PCIe Gen2 x4 with 1.97 GB/s data transfer rates.
Dimensions
WAFER-ADL-P
SBC with
Outwards-facing
Riser Card (NWR-R2S)
SBC with
Inwards-facing
Riser Card (NWR-L2S)
Optional Accessories
Converter Boards
Cables and Connectors
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Hardware Spec.
| 尺寸类型 | |
|---|---|
| 尺寸类型 | 3.5〞 SBC |
| 系统 | |
| CPU | 12th/13th Gen. Intel® mobile Alder Lake-P/Raptor Lake-P on board SoC |
| 内存 | 板载LPDDR4x-3200 MHz 8GB，内存上限为 32GB |
| 内存上限 | 32GB |
| 物理特性 | |
| 尺寸 (LxWxH) (mm) | 146mm x 102mm |
| 净重 | 350g |
| 存储 | |
| 存储 | 1 x SATA : 6Gb/s |
| 1 x M.2(NGFF) : M.2 M Key 2242/2280 (PCIe Gen3 x4) | |
| I/O 接口 | |
| 显示输出 | 2 x HDMI™ : 高达 4096x2160 @ 30Hz |
| 2 x Display Port : 高达 4096 x 2160 @60Hz | |
| 网络 |
2 x LAN - LAN1: Intel® I225V/I226V 2.5GbE controller LAN2: Intel® I225V/I226V 2.5GbE controller |
| 音频 | 1 x HD Audio : 1 x iAUDIO, 支持 IEI AC-KIT-888S 音频模块 (2x5 pin) |
| I/O接口 | 4 x 内部RS-232 : 2x5 pin, P=2.0 |
| 2 x 内部RS-232/422/485 : 2x5 pin, P=2.0 | |
| 4 x 内部 USB 2.0 : 2x4 pin, P=2.0 | |
| 4 x 外部 USB 3.2 Gen2x1 : 10Gb/s(Type A) | |
| 扩展 | 1 x PCIe x4 : PCIe Gen3 x4 (x4 & x2+x2) |
|
3 x M.2(NGFF) - 1 x M.2 A Key 2230 for WIFI & BT (PCIe Gen3 x 1 & USB 2.0) 1 x M.2 M Key 2242/2280 (PCIe Gen3 x4) 1 x M.2 B Key 3042 (PCIe x2 & USB 2.0) 1 x On-board SIM card socket (hinge type) for M.2 B key |
|
| 电源 | |
| 电源功耗 | 12V@2.83A (第 12 代 Intel® Core™ i7-1265UE CPU，8 GB 3200 MHz LPDDR4x 内存，最大值加载，启用 EuP 模式) |
| 电源供电 |
ATX/AT电源 支持AT/ATX模式 符合 ErP/EuP |
| 环境 | |
| 操作温度 | -10°C ~ 60°C |
| 存储温度 | -30°C ~ 70°C |
| Humidity | 5% ~95%, 无冷凝 |
Ordering Information
| WAFER-ADL-P-i7C-R10 | 3.5 SBC supports Intel® Alder Lake-P Core™ i7-1255U Proccessor，with 8GB LPDDR4x memory on board default, with DP ,HDMI™ ,dual 2.5 GbE , USB 3.2 gen 2 , M.2, SATA 6Gb/s, COM,PCIe x4 for riser card and RoHS |
|---|---|
| WAFER-ADL-P-i5C-R10 | 3.5 SBC supports Intel® Alder Lake-P Core™ i5-1235U Proccessor，with 8GB LPDDR4x memory on board default, with DP ,HDMI™ ,dual 2.5 GbE , USB 3.2 gen 2 , M.2, SATA 6Gb/s, COM,PCIe x4 for riser card and RoHS |
| WAFER-ADL-P-i3C-R10 | 3.5 SBC supports Intel® Alder Lake-P Core™ i3-1215U Proccessor，with 8GB LPDDR4x memory on board default, with DP ,HDMI™ ,dual 2.5 GbE , USB 3.2 gen 2 , M.2, SATA 6Gb/s, COM,PCIe x4 for riser card and RoHS |
| WAFER-ADL-P-CC-R10 | 3.5 SBC supports Intel® Alder Lake-P Celeron® 7305 SoC Processor，with 8GB LPDDR4x memory on board default, with DP ,HDMI™ ,dual 2.5 GbE , USB 3.2 gen 2 , M.2, SATA 6Gb/s, COM,PCIe x4 for riser card and RoHS |
Package Contents
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