Specifications
Performance
Connectivity
13th Gen Intel® Core™ Desktop Processors Achieve Breakthrough Performance
The IMBA-Q670 is a performance-oriented ATX industrial motherboard constructed around the latest Intel® Q670E chipset that balances value with premium hardware. The ATX industrial motherboard supports 13th Gen Intel® Core™ processor family featuring hybrid architecture with up to eight Performance-cores (P-core) and up to 16 Efficient-cores (E-core) and delivering powerful computing for heavy workloads applications in intelligent automation, machine learning, data analytics, and even industrial IoT artificial intelligence framework.
Triple Independent Displays with up to 4K Resolution
Enhanced Intel® UHD Graphics driven by Xe Architecture12 deliver vibrant, high-quality visual support for up to 3 simultaneous 4K displays.
Free to Choose Display Interfaces with iDPM Modules
More display I/Os are supported via IEI iDPM connector. The iDPM display converter boards allow the IMBA-ADL-Q670 to meet customers’ diverse display interface requirements such as the legacy display port, VGA and LVDS, or eDP for TFT LCD connection.
Support IPMI 2.0 Management Card with Out-of-Band Management Capability
The IMBA-ADL-Q670 ATX motherboard supports IEI's IPMI 2.0 management card, IRIS2-2620 and IRIS2-2600. IEI's iRIS modules compliant with IPMI 2.0 industry standard specifications simplify the management process of remote edge devices and provide remote monitoring and function control. This is an OS-independent, cross-platform and out-of-band management solution, enabling easy access and configuration of system management options through a web page and KVM redirection. No matter where your edge devices are located, you can remotely manage them even in the absence of an operating system.
Dual Intel® 2.5G Ethernet
The IMBA-ADL-Q670 is equipped with two Intel 2.5GbE controllers, which are ready for the latest-performance router. With two 2.5GbE ports owning the benefits of low-latency, high-throughput and cost-effective, the IMBA-ADL-Q670 can meet the bandwidth-intensive requirements such as large file transfers and high resolution video streaming, which is ideal for machine vision and AI edge computing applications.
Multiple PCIe x16/4 & PCI Expansion Slots
There is an array of expansion interfaces on the IMBA-ADL-Q670 to meet different demands of each customer. It supports up to three PCI, one PCI, three PCIe x4 , two PCIe x1 and one PCIe x16, which can be used to install a variety of interface cards, including motion control cards, frame grabber cards, video capture cards, I/O cards, communication cards, AI accelerator cards and GPU cards.
Dual PCIe Gen3 M.2
Dual PCIe Gen3 M.2 slots provide NVMe SSD support for an incredible performance boost. Supporting both 2242 and 2280 formfactors makes the Addtionally, the innovative M.2 Latch makes it easy to install or remove an SSD from an M.2 slot. The design employs a simple locking mechanism to secure the SSD, eliminating the need for a screw driver.
Optional Accessories
Converter Board
Cables and Connectors
CPU Cooler
Hardware Spec.
尺寸类型 | |
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尺寸类型 | ATX母板 |
系统 | |
CPU | LGA1700 插槽支持第 12/13/14 代 Intel® Core™ i9/i7/i5/i3/Pentium®/Celeron® 处理器(支持高达 125W TDP CPU) |
芯片组 | Intel® Q670/Q670E |
内存 | 4 x 288-pin 3200 双通道 DDR4 SDRAM 无缓存 DIMMs, 支持高达128GB |
内存上限 | 128GB |
散热方案/系统风扇 |
1 x CPU 风扇接口 (1x4 pin) 2 x 系统风扇接口 (1x4 pin) |
物理特性 | |
尺寸 (LxWxH) (mm) | 244mm x 305mm |
净重 | 700g |
存储 | |
存储 | 4 x SATA : 支持RAID 0/1/5/10 |
2 x M.2(NGFF) - 1 x M Key (2242/2280, PCIe x4 ) 1 x M Key (2242/2280, PCIe x2 ) |
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I/O 接口 | |
显示输出 | 1 x HDMI™ : 高达 4096 x 2304 @30Hz |
1 x Display Port : 高达 4096 x 2304 @60Hz | |
1 x iDPM : 支持iEi eDP/ LVDS/ VGA 模块 | |
网络 |
2 x LAN - LAN1: Intel® I225V/I226V 2.5GbE controller (CO-LAY I225-LM support vPro) LAN2: Intel® I225V/I226V 2.5GbE controller (CO-LAY I225-LM support vPro) |
音频 | 1 x HD Audio : iAUDIO, 支持 IEI AC-KIT-888S 音频组件(2 x 5 pin) |
I/O接口 | 2 x 外部RS-232/422/485 : RS-485 支持 AFC |
4 x 内部RS-232 : 2 x 5 pin, P=2.54 | |
2 x 外部 USB 3.2 Gen1x1 : 5Gb/s (Type A) | |
4 x 内部 USB 2.0 : 2 x 4 pin, P=2.54 | |
2 x 内部 USB 3.2 Gen1x1 : 2 x 10 pin, P=2.00 pin wafer (5Gb/s) | |
4 x 外部 USB 3.2 Gen2x1 : 10Gb/s (Type A) | |
扩展 | 1 x PCIe x16 (Gen4 slot with x16 Signal) |
3 x PCIe x4 (Gen4 open-end) | |
2 x PCIe x1 (Gen3) | |
1 x PCI Slot | |
2 x M.2(NGFF) - 1 x M Key (2242/2280, PCIe x4) 支持NVMe存储 1 x M Key (2242/2280, PCIe x2 for SSD) 支持NVMe存储 |
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电源 | |
电源功耗 |
3.3V@1.04A, 5V@10.38A, 12V@5.76A, 5VSB@0.39A (Intel® Core™ i9-12900E CPU with 8 GB 3200 MHz DDR4 memory, EuP mode enabled) |
电源供电 |
ATX/AT电源 支持AT/ATX模式 符合 ErP/EuP |
环境 | |
操作温度 | -10°C~60°C |
存储温度 | -30°C~70°C |
Humidity | 5% ~95%, 无冷凝 |
Ordering Information
IMBA-ADL-Q670-R10 | ATX motherboard supports LGA1700 Intel® 12th/13th/14th Generation Core™ i9/i7/i5/i3, Pentium® and Celeron® processor, DDR4, Triple independent displays, dual 2.5GbE LAN, M.2, USB 3.2, SATA 6Gb/s, iAUDIO and RoHS |
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Package Contents
Package Content |
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