WAFER-ADL-P | |
CPU | 12th/13th Gen. Intel® mobile Alder Lake-P/Raptor Lake-P on board SoC |
Memory | On-board LPDDR4x 3200 MHz 8GB up to 32GB |
Memory Max. | 32GB |
Ethernet | 2 x LAN - LAN1: Intel® I225V/I226V 2.5GbE controller LAN2: Intel® I225V/I226V 2.5GbE controller |
Display Output |
2 x HDMI™: up to 4096x2160 @ 30Hz 2 x Display Port: up to 4096 x 2160 @60Hz |
Audio | 1 x HD Audio: 1 x iAUDIO, support IEI AC-KIT-888S Audio Module (2x5 pin) |
I/O Interface |
4 x Internal RS-232: 2x5 pin, P=2.0 2 x Internal RS-232/422/485: 2x5 pin, P=2.0 4 x Internal USB 2.0: 2x4 pin, P=2.0 4 x External USB 3.2 Gen2x1: 10Gb/s(Type A) |
Storage |
1 x SATA: 6Gb/s 1 x M.2(NGFF): M.2 M Key 2242/2280 (PCIe Gen3 x4) |
Expansion |
1 x PCIe x4: PCIe Gen3 x4 (x4 & x2+x2) 3 x M.2(NGFF) - 1 x M.2 A Key 2230 for WIFI & BT (PCIe Gen3 x 1 & USB 2.0) 1 x M.2 M Key 2242/2280 (PCIe Gen3 x4) 1 x M.2 B Key 3042 (PCIe x2 & USB 2.0) 1 x On-board SIM card socket (hinge type) for M.2 B key |
Power Supply |
ATX/AT power supply Support AT/ATX mode ErP/EuP Compliant |
Power Consumption | 12V@2.83A (12 th Gen Intel® Core™ i7-1265UE CPU with 8 GB 3200 MHz LPDDR4x memory, max. loading, EuP mode enabled) |
Operating Temperature | -10°C ~ 60°C |
Storage Temperature | -30°C ~ 70°C |
Humidity | 5% ~95%, non-condensing |
Dimensions (LxWxH) (mm) | 146mm x 102mm |
Net Weight | 350g |
Form Factor | 3.5〞 SBC |