HPCIE-RPL-Q670 | |
CPU | LGA1700 socket supports 12th/13th/14th generation Alder Lake-S Intel® Core™ i9/i7/i5/i3/Pentium®/Celeron® Processor (up to 65W) |
Chipset | Intel® Q670E/Q670 |
Memory | two 262-pin 5200 MHz Dual-Channel DDR5 So-DIMMs |
Memory Max. | 96GB |
Ethernet | 2 x LAN - LAN1: Intel® I226-LM 2.5GbE controller LAN2: Intel® I226-V 2.5GbE controller |
Display Output |
1 x HDMI™: 4K@30Hz 1 x Display Port: 4K@60Hz, 180° |
Audio | HD Audio: 1 x iAUDIO, support IEI AC-KIT-888S Audio Module (2 x 5 pin) |
I/O Interface |
2 x Internal RS-232/422/485: 2x5 pin, P=2.00 (RS485 support AFC) 4 x Internal USB 2.0: 2x4 pin, P=2.54 1 x DIO: 12-bit digital I/O (2x7 pin) 2 x External USB 3.2 Gen2x1: 10Gb/s (Type-A) 1 x Internal USB 3.2 Gen2x1: Type A 180° 2 x Internal USB 3.2 Gen1x2: 2 X 10 pin P=2.00 (5Gb/s) 1 x I²C: 1x4 pin |
Storage |
2 x SATA: 6Gb/s (RAID 0/1 supported) 1 x M.2(NGFF): M Key (2242, PCIe Gen3 x4) NVMe support |
Expansion | Description:1 x PCIe Gen3 x16 & 4 x PCIe Gen3 x1 signal via golden finger |
Power Supply |
ATX/AT power supply Support AT/ATX mode ErP/EuP Compliant |
Power Consumption |
3.3V@0.05A, 5V@0.93A, 12V@11.33A, 5VSB@0.37A (Intel i9-14900 2GHz CPU with Apacer DDR5 5600MT/s SODIMM 32GB memory, EuP mode enabled) |
Operating Temperature | -10~60℃ |
Storage Temperature | -30°C ~ 70°C |
Humidity | 5% ~95%, non-condensing |
Dimensions (LxWxH) (mm) | 168 mm x 126 mm |
Net Weight | GW:1000g / NW:420g |
M.2 | 1 x M.2 M Key (2242, PCIe Gen3 x4 ) NVMe support |
Cooling method / System Fan |
1 x CPU fan connector (1x4 pin) 1 x System fan connector (1x4 pin) |
TPM | Support TPM 2.0 (TPM-IN03 module) & Intel PTT |
Form Factor | Half Size Single Board Computer |