WAFER-ADL-P

3.5 SBC supports Intel® Alder Lake-P/Raptor Lake-P Core™ i7/i5/i3 and Celeron® processor with 8GB LPDDR4x memory on board default, with DP, HDMI™, dual 2.5 GbE, USB 3.2 gen 2, M.2, SATA 6Gb/s, COM, PCIe x4 for riser card and RoHS

WAFER-ADL-P Front
WAFER-ADL-P IO
WAFER-ADL-P Back
WAFER-ADL-P Side
  • WAFER-ADL-P Front
  • WAFER-ADL-P IO
  • WAFER-ADL-P Back
  • WAFER-ADL-P Side
» Support 12th/13th Intel® mobile Alder Lake-P/Raptor Lake-P on board SoC
» Support on-board LPDDR4x 3200 MHz 8GB memory, up to 32GB
» Support quadruple independent display via two HDMI™ and two DP
» Support PCIe X4, M.2 M key, M.2 B key and M.2 A key expansion
» Suport two 2.5GbE LAN with I225V/I226V

High-performance 12th/13th Gen Intel Core Mobile Processors

The WAFER-ADL-P Series is powered by the 12th/13th Gen Intel Core Mobile Processors for powerful 5-core to 10-core performance with efficient system power consumption. Furthermore, it leverages the breakthrough Performance Hybrid Architecture for dramatic increases to single- and multi-threaded performance combined with graphics density and AI acceleration in small form factor but high-performance designs.

4K Quadruple Independent Displays

The WAFER-ADL-P integrates Intel® Iris® Xe Graphics, delivering up to 2.47x faster graphics performance compared to 11th Gen Intel Core processors. With Intel® Iris® Xe Graphics, the board can feature up to 96 graphics EUs and also provide up to four concurrent 4K independent displays. This is ideal for video wall and surveillance applications.

PCIe x4 Expansion Allows Extensive I/O and Function Expansion

Outwards-facing Expansions

Inwards-facing Expansions

PCIe x4 Interface Card Expansion

Outwards-facing Expansions:
Two PCIe x1 / One PCIe x2

The outwards-facing riser card, NWR-L2S, enables the connection of up to two outwards-facing PCIe x1 slots via one PCI Express interface. Although may take up more space, it can help enhance the airflow and heat transfer within the system. It is ideal for the chassis that is wide enough for the expansion card to be placed.

Inwards-facing Expansions:
Two PCIe x1 / One PCIe x2

The inwards-facing riser card, NWR-R2S, enables the connection of up to two inwards-facing PCIe x1 slots via one PCI Express interface. It is suitable for installation where space is limited. With higher height to increase spacing between boards, it can ensure efficient heat dissipation for space-constrained applications.

PCIe x4 Interface Card Expansion

The PCIe Gen3 x4 (x2 signal) slot, providing high-speed data transfer rate of up to 2GB/s, allows for additional customization and expansion. Directly installing a PCIe card enables the motherboard to run more complex and challenging tasks at the edge.

Enhanced Stability and Easy Installation

Both of the riser cards can be firmly secured to enhance stability by using the L-shaped bracket, in which screw holes are perfectly matched with those on the side of the heat spreader to make it simple and easy to install.

Well-Design Thermal Solution

IEI Heat Conduction Casing (IHCC)

Diverse Mounting

Fitting Different Mounting Needs

IEI Heat Conduction Casing (IHCC)

IEI has developed a highly efficient thermal solution for the 3.5" SBC - the IEI Heat Conduction Casing (IHCC). The IHCC effectively enhances heat transfer performance by targeting the primary heat source, thus eliminating the need for designing a separate heat spreader.
The IHCC consists of a casing and a heat conduction block that securely fits over the key components where the major heat is generated, ensuring optimal heat transfer.

Diverse Mounting Options

With its well-design thurmal casing, WAFER-ADL-P provides complete 13 holes on three sides. It can be conveniently mounted on the back panel, door, or DIN rail of a control cabinet. Moreover, installing an extra thermal module for optimal performance in elevated ambient temperatures is a straightforward process.

Fitting different mounting needs

Catering to various mounting requirements, such as Embedded System, Electrical Cabinet, and the versatile stacking of Flexible Thermal Modules.

Dual Low-Latency 2.5G LAN Powered by Intel

2.5 GbE allows for different connection speeds ranging from 100 Mbps to 2.5 Gbps on Cat6 and Cat 5e cables, enabling users to fully utilize high-performance network solutions without costly cable upgrades.

M.2 Expansion for Wi-Fi and NVMe Storage

M.2 2230 A Key for Wi-Fi/Bluetooth

The M.2 2230 A key slot, carrying PCIe Gen3 x1 and USB 2.0 signals, allows it to adopt the latest Wi-Fi 6E technology. Wi-Fi 6E enhances low latency and supports service levels equivalent to 5G networks.

M.2 3042 B Key Slot for LTE & 4G

The M.2 3042 B key slot has PCIe Gen3 x1 and USB 2.0 signals. With an on-board SIM card socket, it become effortless to integrate LTE/4G wireless connectivity. This enables seamless access to fast cellular networks and advanced communication technologies.

M.2 2242/80 M Key for Fast Transfer Speed NVMe SSD Storage

The configurable M.2 2242/80 M key slot supports high-speed PCIe Gen3 x4 3.94 GB/s, making the NVMe SSD twice as fast as PCIe Gen2 x4 with 1.97 GB/s data transfer rates.

Dimensions

WAFER-ADL-P

SBC with
Outwards-facing
Riser Card (NWR-R2S)

SBC with
Inwards-facing
Riser Card (NWR-L2S)

SBC with Outwards-facing Riser Card
SBC with Outwards-facing Riser Card (R4S)

Hardware Spec.

Form Factor
Form Factor 3.5〞 SBC
System
CPU 12th/13th Gen. Intel® mobile Alder Lake-P/Raptor Lake-P on board SoC
Memory On-board LPDDR4x 3200 MHz 8GB up to 32GB
Memory Max. 32GB
Physical Characteristics
Dimensions (LxWxH) (mm) 146mm x 102mm
Net Weight 350g
Storage
Storage 1 x SATA : 6Gb/s
1 x M.2(NGFF) : M.2 M Key 2242/2280 (PCIe Gen3 x4)
I/O Interface
Display Output 2 x HDMI™ : up to 4096x2160 @ 30Hz
2 x Display Port : up to 4096 x 2160 @60Hz
Ethernet 2 x LAN -
LAN1: Intel® I225V/I226V 2.5GbE controller
LAN2: Intel® I225V/I226V 2.5GbE controller
Audio 1 x HD Audio : 1 x iAUDIO, support IEI AC-KIT-888S Audio Module (2x5 pin)
I/O Interface 4 x Internal RS-232 : 2x5 pin, P=2.0
2 x Internal RS-232/422/485 : 2x5 pin, P=2.0
4 x Internal USB 2.0 : 2x4 pin, P=2.0
4 x External USB 3.2 Gen2x1 : 10Gb/s(Type A)
Expansion 1 x PCIe x4 : PCIe Gen3 x4 (x4 & x2+x2)
3 x M.2(NGFF) -
1 x M.2 A Key 2230 for WIFI & BT (PCIe Gen3 x 1 & USB 2.0)
1 x M.2 M Key 2242/2280 (PCIe Gen3 x4)
1 x M.2 B Key 3042 (PCIe x2 & USB 2.0)
1 x On-board SIM card socket (hinge type) for M.2 B key
Power
Power Consumption 12V@2.83A (12 th Gen Intel® Core™ i7-1265UE CPU with 8 GB 3200 MHz LPDDR4x memory, max. loading, EuP mode enabled)
Power Supply ATX/AT power supply
Support AT/ATX mode
ErP/EuP Compliant
Environment
Operating Temperature -10°C ~ 60°C
Storage Temperature -30°C ~ 70°C
Humidity 5% ~95%, non-condensing

Ordering Information

WAFER-ADL-P-i7C-R10 3.5 SBC supports Intel® Alder Lake-P Core™ i7-1255U Proccessor,with 8GB LPDDR4x memory on board default, with DP ,HDMI™ ,dual 2.5 GbE , USB 3.2 gen 2 , M.2, SATA 6Gb/s, COM,PCIe x4 for riser card and RoHS
WAFER-ADL-P-i5C-R10 3.5 SBC supports Intel® Alder Lake-P Core™ i5-1235U Proccessor,with 8GB LPDDR4x memory on board default, with DP ,HDMI™ ,dual 2.5 GbE , USB 3.2 gen 2 , M.2, SATA 6Gb/s, COM,PCIe x4 for riser card and RoHS
WAFER-ADL-P-i3C-R10 3.5 SBC supports Intel® Alder Lake-P Core™ i3-1215U Proccessor,with 8GB LPDDR4x memory on board default, with DP ,HDMI™ ,dual 2.5 GbE , USB 3.2 gen 2 , M.2, SATA 6Gb/s, COM,PCIe x4 for riser card and RoHS
WAFER-ADL-P-CC-R10 3.5 SBC supports Intel® Alder Lake-P Celeron® 7305 SoC Processor,with 8GB LPDDR4x memory on board default, with DP ,HDMI™ ,dual 2.5 GbE , USB 3.2 gen 2 , M.2, SATA 6Gb/s, COM,PCIe x4 for riser card and RoHS

Package Contents

Package Content
  • 1 x WAFER-ADL-P single board computer

  • 1 x SATA cable

  • 1 x QIG