» Intel® Celeron® Processor N6210 (code name: Elkhart Lake)
» Fanless system
» 4 x USB 3.2 Gen 2
» On-board eMMC 32GB
» On-board LPDDR4x 8GB
Intel® Celeron® Processor N6210
(code name: Elkhart Lake)
CPU TDP 6.5W
Either lower power consumption at the same performance, or higher performance at equal TDP
Up to a 1.7x improvement in single-thread performance
Processor performance boost
Up to a 1.5x improvement in multi-thread performance generation over generation
Processor performance boost
Up to 2x performance improvement in graphics over previous generation
Doubling graphics speed for immersive experiences
Bay Trail vs. Elkhart Lake
| Product Name | Previous product version | HTB-150-N6210 |
| CPU | N2930 | N6210 |
| Platform | Bay Trail | Elkhart Lake |
| Node | 22 nm | 10 nm |
| Total Cores | 2 | 4 |
| Total Threads | 2 | 4 |
| Processor Base Frequency | 1.83 GHz | 1.20 GHz |
| Integrated Graphics | Intel® HD Graphics for Intel® Atom®Processor Z3700 Series |
Intel® UHD Graphics for 10th Gen Intel® Processors |
| TDP | 7.5 W | 6.5 W |
| Max Memory Size | 8 GB | 32 GB |
| Memory Types | DDR3L 1333 | LPDDR4x 8GB (on board) |
| Use Cases | Embedded Broad Market Commercial Temp, PC/Client/Tablet |
PC/Client/Tablet |
Fanless System
Metal chassis
Low failure rate
The easy-to-clean surface can lower dust accumulation; solid construction makes it highly durable
The housing is entirely made of metal, enhancing cooling, durability and strength.
Large area of heat fins
Silently
Without fan, the system can run silently and be a quiet partner with patients
Heat fins are metal fins that increase the surface area for heat dissipation, improving the cooling performance. The larger the area of the heat fins, the more effective they are in dissipating heat.
Metal chassis
Low failure rate
The easy-to-clean surface can lower dust accumulation; solid construction makes it highly durable
The housing is entirely made of metal, enhancing cooling, durability and strength.
Large area of heat fins
Silently
Without fan, the system can run silently and be a quiet partner with patients
Heat fins are metal fins that increase the surface area for heat dissipation, improving the cooling performance. The larger the area of the heat fins, the more effective they are in dissipating heat.
USB 3.2 Gen 2 (Type A)
USB 3.2 Gen 2 provides a single lane of 10Gbps. This mode – marketed under SuperSpeed USB 10Gbps – is also the fastest speed that Thunderbolt 3 supports natively. Note that passive cables are mostly 1m or shorter in length in order to maintain optimal signal quality transferring data in USB 3.2 Gen 2.
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| Previous specifications | USB 1.0 | USB 2.0 | USB 3.0 USB 3.1 Gen 1 |
USB 3.1 USB 3.1 Gen 2 |
USB 3.2 USB 3.2 Gen 2x2 |
| Newer specification |
USB 1.0 (no change) |
USB 2.0 (no change) |
USB 3.2 Gen 1 | USB 3.2 Gen 2 | USB 3.2 Gen 2x2 |
| Maximum transfer rate | 12 Mb/s | 480 Mb/s | 5 Gb/s | 10 Gb/s | 20 Gb/s |
On-board LPDDR4x 8GB
On-board eMMC 32GB
M.2 M key & A key
LPDDR4x is an enhancement bringing even lower voltage, allowing more power efficient memory and ultimately, longer battery life for your devices.
It is ideal for demanding applications and is highly reliable. Considering its size, eMMC is capable of handling extremely large amounts of data in such a small footprint.
AM.2 2230 A key slot
It supports Wi-Fi and Bluetooth modules, providing a convenient and space-saving solution for integrating wireless functionality into a system.
BM.2 2280 M key slot
It offers high-speed data transfer rates, increased storage capacity, and improved system responsiveness.
Space Saving & Safe
Compact size
It is small enough to fit in the palm of your hand, making it convenient to carry and use in any setting. Its small size makes it versatile and suitable for various environments.
Medical certification
We ensure it is safe and of high quality for medical use, providing peace of mind for users.
Applications
I/O Interfaces & Dimensions
Hardware Spec.
| System | |
|---|---|
| Processor | Intel® Celeron® Processor N6210 |
| Supported OS | Windows 10; Windows 11; Linux Ubuntu |
| Network | |
| Wi-Fi | IEEE 802.11a/b/g/n/ax, Intel® Wi-Fi 6E AX210 (optional) |
| Bluetooth | v5.2 |
| Storage | |
| Storage | On-board eMMC 32GB |
| RAM | On-board LPDDR4x 8GB |
| Expansion Slots | |
| Expansion Slots |
1 x M.2 2230 A key slot (PCIe + USB) 1 x M.2 2280 M key slot (PCIe) |
| I/O Interface | |
| Front I/O |
1 x Power on/off switch (with power LED) 1 x Reset button 1 x Clear CMOS 1 x AT/ATX switch 4 x USB 3.2 Gen 2 (Type A) |
| Rear I/O |
1 x 12V DC jack 1 x RS-232 1 x HDMI™ out 2 x GbE LAN |
| Indicator&Buttons | |
| Indicators | Power LED |
| Physical Characteristics | |
| Thermal | Fanless |
| Construction Material | Extruded aluminum alloys |
| Mounting | VESA 75 x 75 mm |
| Weight (Net) (kg) | 0.688 |
| Weight (Gross) (kg) | 1.84 |
| Dimensions (LxWxH) (mm) | 137 x 102.8 x 36 |
| Power | |
| Power Adapter | 65W medical grade power adapter |
| Environment | |
| Operating Temperature | 0°C ~ 40°C |
| Storage Temperature | -20°C ~ 60°C |
| Humidity | 10% ~ 95% (non-condensing) |
| Vibration | 1G |
| Operating Shock | 5G peak acceleration (11ms duration) |
| Non-operating shock | 15G peak acceleration (11ms duration) |
| Certifications | |
| Safety & EMC | CE, FCC Class B Part18, UL 60601-1, IEC/EN 60601-1, IEC/EN 60601-1-2 |
Ordering Information
| HTB-150-N6210-R10 | Fanless embedded system, Intel® Celeron® N6210, on-board LPDDR4x 8GB, on-board eMMC 32GB, mounting kits, R10, RoHs |
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Package Contents
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