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HPCIE-Q470

Half-size PICMG 1.3 CPU Card supports LGA1200 Intel® 10th/11th Gen. Core™ i9/i7/i5/i3, Pentium®, Celeron® CPU with Q470/Q470E, DDR4 SO-DIMM, HDMI™, Dual Intel® 2.5GbE, USB 3.2 Gen2, SATA 6Gb/s, M.2, IAUDIO, and RoHs

HPCIE-Q470 Half-size PICMG 1.3 CPU Card
HPCIE-Q470 Half-size PICMG 1.3 CPU Card
HPCIE-Q470 Half-size PICMG 1.3 CPU Card
HPCIE-Q470 Half-size PICMG 1.3 CPU Card
  • HPCIE-Q470 Half-size PICMG 1.3 CPU Card
  • HPCIE-Q470 Half-size PICMG 1.3 CPU Card
  • HPCIE-Q470 Half-size PICMG 1.3 CPU Card
  • HPCIE-Q470 Half-size PICMG 1.3 CPU Card
1. LGA1200 Intel® 10th/11th Generation Core™ i9/i7/i5/i3, Celeron® and Pentium® processor
2. Dual-channel DDR4 2933MHz
3. Support Dual Intel® 2.5GbE
4. Support M.2 A key for WLAN expansion, M key for PCIe NVMe storage

Maximizes Design Flexibility

The HPCIE-Q470 is a half-size PICMG 1.3 SBC supporting 10th/11th generation Intel® Core™, Pentium® or Celeron® processor with Intel® Q470 chipset. Aimed at customers who are seeking compact system with high computing power and flexible expansion capabilities.

With versatile IEI passive backplanes and industrial chassis options, the compact configurable system offers increased computing efficiency, flexible I/O expandability especailly with PCIe x16 , PCIe x8 and legacy PCI signals through backplane allowing more industrial add-on cards to satisfy the requirements of performance-demanding applications in quality defect inspection, digital surveillance, transportation and automation applications.

Spec Overview

Performance

Connectivity

Cooling

Component Side

  • Two 260-pin 2933 MHz dual-channel
    DDR4 SO-DIMMs
    support up to 64GB
  • 12V CPU DC input
  • 1 x M.2 2230 A key slot
    (PCIe Gen3 x2 + USB 2.0)
  • LGA1200 socket for 10th/11th Gen
    Intel® Core™, Pentium® and
    Celeron® processors
  • Intel® Q470/Q470E

Solder Side

  • 1x M.2 2242/2280 M key slot (PCIe Gen3 x4)
  • 2 x RS-232/422/485 (RS-485 supports AFC)
  • 2 x SATA 6Gbps ports (RAID 0/1)
  • Front Panel
  • DIO
  • IAUDIO for AC-KIT-888S 7.1 channel HD Audio kit
  • 2 x 2.5GbE via Intel® I225V
  • 1 x HDMI™ 1.4b (4096 x 2160 @30Hz)
  • 1 x USB 3.2 Gen 2 (10Gb/s) by USB Type-C connector
  • 2 x USB 3.2 Gen 1 (5Gb/s)
  • 2 x USB 2.0

CF-115XA

1U chassis compatible,73W

CF-1156C

1U chassis compatible,45W

CF-1156D

1U chassis compatible,65W

CF-115XE

High performance,95W

Performance

    Component Side
  • 1
    Two 260-pin 2933 MHz dual-channel DDR4 SO-DIMMs, support up to 64GB
  • 2
    12V CPU DC input
  • 3
    1 x M.2 2230 A key slot (PCIe Gen3 x2 + USB 2.0)
  • 4
    LGA1200 socket for 10th/11th Gen Intel® Core™, Pentium® and Celeron® processors
  • 5
    Intel® Q470/Q470E
    Solder Side
  • 6
    One 260-pin 2933 MHz dual-channel DDR4 SO-DIMM supporting up to 16 GB

Connectivity

  • 1
    2 x RS-232/422/485(RS-485 supports AFC)
  • 2
    2 x SATA 6Gbps ports (RAID 0/1)
  • 3
    Front Panel
  • 4
    DIO
  • 5
    IAUDIO for AC-KIT-888S 7.1 channel HD Audio kit
  • 6
    2 x 2.5GbE via Intel® I225V
  • 7
    1 x HDMI™ 1.4b (4096 x 2160 @30Hz)
  • 8
    1 x USB 3.2 Gen 2(10Gb/s) by USB Type-C connector
  • 9
    2 x USB 3.2 Gen 1 (5Gb/s)
  • 10
    2 x USB 2.0

Cooling
CF-115XA

1U chassis compatible,73W
CF-1156C

1U chassis compatible,45W
CF-1156D

1U chassis compatible,65W
CF-115XE

High performance,95W

Half-size PICMG 1.3

Standard PICMG 1.3 SBCs have several advantages over non-standard SBCs. Firstly, they are more maintainable than a motherboard system and have a much lower mean time to repair (MTTR). Secondly, it is easy to upgrade to a newer or faster processor if desired.

Features of PICMG 1.3:

  • 20 PCI Express
    20 PCI Express lanes are supported, including PCI Express x16, x8, x4 and x1 configurations

  • ATX power signals are supported
    Provides AUX voltages for standby power and sleep states (soft starts, wake on LAN), supports PSON#, PWRGD, PWRRBT# and ACPI states

Various backplane configuration options are provided by the PICMG 1.3 specification to meet the different needs encountered in embedded computing applications.

Enhanced CPU Performance

The performance boosts up to 80% better than previous generation on i5 processor. The 10th Gen Intel® Core platform supports up to 10 cores and improved performance over Coffee Lake-Refresh. With increased I/O capacity and the latest DDR4-2933 memory support, these processors deliver the performance required to consolidate industrial multiple workloads.

Embedded CPU Support List for 10th Gen Intel® Processors

Sockets Brand Process Cores/Threads CPU Processor Base Frequency Cache TDP Processor Graphics Graphics Base Frequency Memory Types Chipset
FCLGA1200 CoreTM i9 14nm Comet Lake-S 10/20 I9-10900E 2.8 GHz 20MB 65W Intel® UHD Graphics 630 350 MHz DDR4-2933 Q470/Q470E
10/20 I9-10900TE 1.8 GHz 20MB 35W DDR4-2933
CoreTM i7 8/16 I7-10700E 2.9 GHz 16MB 65W DDR4-2933
8/16 I7-10700TE 2.0 GHz 16MB 35W DDR4-2933
CoreTM i5 6/12 I5-10500E 3.1 GHz 8MB 65W DDR4-2666
CoreTM i5 6/12 I5-10500TE 2.3 GHz 8MB 35W DDR4-2666
CoreTM i3 4/8 I3-10100E 3.2 GHz 9MB 65W DDR4-2666
CoreTM i3 4/8 I3-10100TE 2.3 GHz 9MB 35W DDR4-2666
Pentium® 2/4 G6400E 3.8 GHz 4MB 58W DDR4-2400
Pentium® 2/4 G6400TE 3.2 GHz 4MB 35W DDR4-2400
Celeron® 2/2 G5900E 3.2 GHz 2MB 58W DDR4-2400
Celeron® 2/2 G5900TE 3.0 GHz 2MB 35W DDR4-2400

Delivering HDMI™ 4K Resolution for Real-time Monitoring

Equipped with Intel® UHD Graphics to display videos and images in stunning 4K (4096x2160 @30 Hz) resolutions.

DM-F Series

IEI 12.1"to 24" Industrial Monitors

Equipped with Intel® UHD Graphics to display videos and images in stunning 4K (4096x2160 @30 Hz) resolutions.

DM-F Series

IEI 12.1"to 24" Industrial Monitors

Equipped with Intel® UHD Graphics to display videos and images in stunning 4K (4096x2160 @30 Hz) resolutions.

Connectivity

10 Gb/s USB 3.2 Gen 2 Type-C foolproof connector

USB Type-C connectors are widely adopted by many electronic devices, such as portable SSD hard drives, smart phones, USB cameras, etc. The HPCIE-Q470 uses the reversible connector that should end the bane of users fiddling at the back of computers.

SATA 6 Gb/s Storage Performance with RAID 0/1 Protection

Protection

  • Vibration free lockable SATA connectors and cables to protect the connection between HDD and SBC

  • RAID 1 with mirror function provides redundancy data protection

Performance

  • RAID 0 enables faster storage performance with data striping to protect against data loss from a hard drive failure by mirroring all data across multiple devices.

  • SATA 6Gb/s is well suited for such as video editing because they require high performance to memory.

RAID 0 Speed Mode

RAID 0 mode (stripping) provides higher data reading and writing performances by dividing a single file into two files and storing one on each drive.

RAID 1 Safe Mode

RAID 1 mode (mirroring) backs up the identical data in both drives to prevent data loss from hard drive failure.
 

Networking

M.2 2230 A Key for Wi-Fi/Bluetooth

The M.2 2230 A key slot carrying with PCIe 3.0 x1 and USB 2.0 signals allows it to adopt the latest Wi-Fi 6E technology. Wi-Fi 6E enhances low latency and supports service levels that are equivalent to 5G networks.

Delivering Dual Low-Latency 2.5G LAN Powered by Intel

The two on-board Intel® I225V 2.5GbE controllers enable the HPCIE-Q470 to meet the bandwidth-intensive requirements such as large file transfers and high-resolution video streaming.

IP Camera

Redundant Backup

Instant System-level Solution

To suit different AIoT applications, IEI offers a comprehensive range of PICMG 1.3 passive backplanes and industrial chassis to give system designers expanded options for integrating multi-level processors within a variety of configurations.

NO.

Chassis Type

Dimensions (DxWxH) (mm)

Industrial Chassis

PICMG 1.3 Half-size Backplane

Expansions
1

Wall-mount System

254mm x 286mm x 132mm

PR-1500G

HPXE2-5S1

2 x PCI
1 x PCIe Gen3 x16
2

PAC-125G

HPXE2-8S1

 		2 x PCI
4 x PCIe Gen3 x8
3 4U System 254mm x 286mm x 132mm

RACK-3000G

HPXE2-8S1

 		4 x PCI
2 x PCIe Gen3 x8
4

RACK-360G

HPXE2-8S1

 		4 x PCI
2 x PCIe Gen3 x8

Specifications

Hardware Spec.

Form Factor
Form Factor Half Size Single Board Computer
System
CPU LGA1200 Intel® 10th/11th Gen. Core™ i9/i7/i5/i3,Pentium® and Celeron® processor(Support up to 65w)
Chipset Intel® Q470/Q470E
Memory 2 x 260-pin 2933 MHz Dual-channel DDR4 SO-DIMM,support up to 64G
Memory Max. up to 64GB
Cooling method / System Fan 1 x CPU fan connector (1x4 pin)
Physical Characteristics
Dimensions (LxWxH) (mm) 185 mm x 126 mm
Net Weight 420g
Storage
Storage 2 x SATA : 6Gb/s (support RAID 0/1)
1 x M.2(NGFF) : M Key (2242/2280) with PCIe Gen3 x4 ,support NVME storage
I/O Interface
Display Output 1 x HDMI™ : up to 4096 x 2160@30Hz
Ethernet 2 x LAN :
LAN1: Intel® I225V 2.5GbE controller
LAN2: Intel® I225V 2.5GbE controller
Audio 1 x HD Audio : 1 x IAUDIO, support IEI AC-KIT-888S Audio Module (2 x 5 pin)
I/O Interface 2 x Internal RS-232/422/485 : 2x5 pin, P=2.00 ,RS-485 support AFC
2 x External USB 3.2 Gen1x1 : 5Gb/s (Type-A)
2 x Internal USB 2.0 : 2x4 pin, P=2.00
DIO : 12-bit digital I/O (2x7 pin)
1 x External USB 3.2 Gen2x1 : 10Gb/s (Type-C)
Expansion 1 x PCIe x16 :
signal from CPU via golden finger
(supports x16, or x8 + x8, or x4 + x4 + x8)
1 x PCIe x4 :
signal from PCH via golden finger
(supports x4, or x1 + x1 + x1 + x1)
2 x M.2(NGFF) :
1 x M.2 A key (2230) with PCIe Gen3 x2/USB 2.0
1 x M.2 M key (2280/2242) with PCIe Gen3 x4
Power
Power Supply 5V/12V, ATX/AT power supply
Support AT/ATX mode
ErP/EuP Compliant
Environment
Operating Temperature 0°C – 60°C
Storage Temperature -30°C – 70°C
Humidity 5% ~ 95%, non-condensing
Certifications
Safety & EMC CE/FCC compliant

Ordering Information

HPCIE-Q470-R10 Half-size PICMG 1.3 CPU Card supports LGA1200 Intel® 10th Gen. Core™ i9/i7/i5/i3/Pentium®/Celeron® CPU with Q470E, DDR4 SO-DIMM, HDMI™, USB-C, Dual Intel® 2.5GbE, USB 3.2, SATA 6Gb/s, M.2, HD Audio, iAMT and RoHs

Package Contents

Package Content

  • 1 x HPCIE-Q470 single board computer

  • 2 x SATA cable

  • 1 x I/O shielding

  • 1 x QIG

Download Specs.

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